RS3A Datasheet, PDF (1/2 Pages) Shanghai Sunrise Electronics – SURFACE MOUNT FAST SWITCHING RECTIFIER

RS3A/B - RS3M/B
3.0A SURFACE MOUNT FAST RECOVERY RECTIFIER
Features
· Glass Passivated Die Construction
· Fast Recovery Time for High Efficiency
· Low Forward Voltage Drop and High Current
Capability
· Surge Overload Rating to 100A Peak
· Ideally Suited for Automatic Assembly
· Plastic Material: UL Flammability
Classification Rating 94V-0
Mechanical Data
· Case: Molded Plastic
· Terminals: Solder Plated Terminal -
Solderable per MIL-STD-202, Method 208
· Polarity: Cathode Band or Cathode Notch
· Marking: Type Number
· SMB Weight: 0.09 grams (approx.)
· SMC Weight: 0.20 grams (approx.)
B
A
J
H
G
E
SMB
SMC
Dim Min Max Min Max
A 3.30 3.94 5.59 6.22
C
B 4.06 4.57 6.60 7.11
C 1.96 2.21 2.75 3.18
D 0.15 0.31 0.15 0.31
D
E 5.00 5.59 7.75 8.13
G 0.10 0.20 0.10 0.20
H 0.76 1.52 0.76 1.52
J 2.00 2.62 2.00 2.62
All Dimensions in mm
AB, BB, DB, GB, JB, KB, MB Suffix Designates SMB Package
A, B, D, G, J, K, M Suffix Designates SMC Package
Maximum Ratings and Electrical Characteristics ^{@ TA = 25°C unless otherwise specified}
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Symbol
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V_RRM
VRWM
VR
RMS Reverse Voltage
VR(RMS)
Average Rectified Output Current
@ T_T = 75°C
I_O
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load IFSM
(JEDEC Method)
Forward Voltage
@ IF = 3.0A V_FM
Peak Reverse Current
at Rated DC Blocking Voltage
@ T_A = 25°C
@ TA = 125°C
I_RM
Maximum Recovery Time (Note 3)
trr
Typical Junction Capacitance (Note 2)
Cj
Typical Thermal Resistance Junction to Terminal (Note 1) RqJT
Operating and Storage Temperature Range
Tj, TSTG
RS3
A/AB
50
35
RS3 RS3 RS3 RS3
B/BB D/DB G/GB J/JB
100 200 400 600
70
140 280 420
3.0
100
1.3
5.0
250
150
250
50
25
-65 to +150
RS3
K/KB
RS3
M/MB
Unit
800 1000 V
560 700 V
A
A
V
mA
500
ns
pF
K/W
°C
Notes:
1. Thermal resistance: junction to terminal, unit mounted on PC board with 5.0 mm² (0.013 mm thick) copper pad as heat sink.
2. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
3. Reverse recovery test conditions: I_F = 0.5A, I_R = 1.0A, I_rr = 0.25A. See figure 5.
DS15005 Rev. E-2
1 of 2
RS3A/B - RS3M/B