QZX563C6V8C_15 Datasheet, PDF (1/3 Pages) Diodes Incorporated – QUAD SURFACE MOUNT TVS ARRAY

Features
• Quad TVS in Common Anode Configuration
• Nominal Zener Voltage: 6.8V
• Ultra-Small Surface Mount Package
• Ideal For Transient Suppression
• Lead Free By Design/RoHS Compliant (Note 1)
• "Green Device" (Note 2)
• Qualified to AEC-Q101 Standards for High Reliability
ESD Capability
• IEC 61000-4-2 Contact Method: ±8kV
• IEC 61000-4-2 Air Discharge Method: ± 25kV
QZX563C6V8C
QUAD SURFACE MOUNT TVS ARRAY
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Mechanical Data
• Case: SOT-563
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminal Finish: Matte Tin, Annealed Over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
• Orientation: See Diagram
• Marking Information: See Page 3
• Ordering Information: See Page 3
• Weight: 0.003 grams (approximate)
C₁ NC
C₂
Top View
Bottom View
Maximum Ratings @T_A = 25°C unless otherwise specified
C₄
A
C₃
Device Schematic
Characteristic
Symbol
Value
Unit
Peak Power Dissipation, 10x1000μS Waveform (Note 5)
Peak Power Dissipation, 8x20μS Waveform (Note 5)
P_pk
10
80
W
Forward Voltage @ I_F = 10mA (Note 3)
V_F
0.9
V
Forward Voltage @ I_F = 100mA (Note 3)
V_F
1.0
V
Thermal Characteristics
Characteristic
Power Dissipation (Note 4)
Thermal Resistance, Junction-to-Ambient (Note 4)
Operating and Storage Temperature Range
Symbol
P_D
R_θJA
T_J, T_STG
Value
150
833
-65 to +150
Unit
mW
°C/W
°C
Electrical Characteristics @T_A = 25°C unless otherwise specified
Type
Number
QZX563C6V8C
Marking
Code
CB
Reverse Standoff Voltage
and Leakage
V_RWM
V
5
I_R @ V_RWM
μA
1.5
Breakdown Voltage
(Note 3)
V_BR @ I_T = 1mA
Min (V) Nom (V) Max (V)
6.47
6.8
7.14
Maximum Reverse
Current
(Note 3)
I_R @ V_R
μA
V
1.0
3.0
Typical Junction
Capacitance
C_T @ V_R = 0V,
f = 1MHz
pF
63
Notes:
1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Short duration pulse test used to minimize self-heating effect.
4. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. Suggested Pad Layout Document AP02001,
which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
5. Non-repetitive current pulse per Figure 2 & 3 and derate above T_A = 25°C per Figure 1.
QZX563C6V8C
Document number: DS30716 Rev. 4 - 2
1 of 3
www.diodes.com
July 2008
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