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PDR5G Datasheet, PDF (1/3 Pages) Diodes Incorporated – 5A GLASS PASSIVATED RECTIFIER
SPICE MODEL: PDR5G
PDR5G
5A GLASS PASSIVATED RECTIFIER
PowerDI ä5
Features
· Glass Passivated Die Construction
· Low Leakage Current
· Lead Free Finish, RoHS Compliant (Note 1)
· "Green" Molding Compound (No Br, Sb)
· Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
· Case: PowerDIä5
· Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating 94V-0
· Moisture Sensitivity: Level 1 per J-STD-020C
· Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208 e3
· Polarity: See Diagram
· Marking: See Page 3
· Weight: 0.096 grams (approximate)
D
b2
L1
A
A2
E
E1
L1
e
b1
b1
A2
D
D2
b2
L
E2 E
W
L1
e
b1
b1
LEFT PIN
RIGHT PIN
BOTTOMSIDE
HEAT SINK
Note: Pins Left & Right must
be electrically connected
at the printed circuit board.
PowerDIä5
Dim Min
Max
A
1.05
1.15
A2 0.33 0.43
b1 0.80 0.99
b2 1.70 1.88
D
3.90
4.05
D2
3.05 NOM
E
6.40 6.60
e
1.84 NOM
E1 5.30 5.45
E2
3.55 NOM
L
0.75 0.95
L1 0.50 0.65
W 1.20 1.50
All Dimensions in mm
Maximum Ratings @ TA = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (See also figure 4)
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
Operating Temperature Range
Storage Temperature Range
Symbol
VRRM
VRWM
VR
VR(RMS)
IO
IFSM
Tj
TSTG
Value
Unit
400
V
283
V
5
A
100
A
-65 to +150
°C
-65 to +150
°C
Thermal Characteristics @ TA = 25°C unless otherwise specified
Characteristic
Thermal Resistance Junction to Soldering Point
Thermal Resistance Junction to Ambient Air (Note 2)
Thermal Resistance Junction to Ambient Air (Note 3)
Thermal Resistance Junction to Ambient Air (Note 4)
Symbol
Typ
RqJS
¾
RqJA
75
RqJA
65
RqJA
45
Max
1.5
¾
¾
¾
Notes:
1. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
2. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
3. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Polymide PCB, 2 oz. Copper. Cathode pad dimensions 9.4 mm x 7.2 mm. Anode pad dimensions 2.7 mm x 1.6 mm.
Unit
°C/W
°C/W
°C/W
°C/W
DS30552 Rev. 5 - 2
PowerDI is a trademark of Diodes Incorporated.
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