MMSZ5263B_15 Datasheet, PDF (1/3 Pages) Diodes Incorporated – 500mW SURFACE MOUNT ZENER DIODE

Features
• Planar Die Construction
• 500mW Power Dissipation
• General Purpose, Medium Current
• Ideally Suited for Automated Assembly Processes
• Lead, Halogen and Antimony Free, RoHS Compliant
• "Green" Device (Note 4)
• Qualified to AEC-Q101 Standards for High Reliability
MMSZ5263B
500mW SURFACE MOUNT ZENER DIODE
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Mechanical Data
• Case: SOD-123
• Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
• Polarity: Cathode Band
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.01 grams (approximate)
Top View
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Forward Voltage (Note 3)
@ I_F = 10mA
V_F
0.9
V
Thermal Characteristics
Characteristic
Power Dissipation (Note 1) @T_L = 75°C
Thermal Resistance, Junction to Ambient Air (Note 1)
Thermal Resistance, Junction to Lead (Note 2)
Operating and Storage Temperature Range
Symbol
P_D
R_θJA
R_θJL
T_J, T_STG
Value
500
350
150
-65 to +150
Unit
mW
°C/W
°C/W
°C
Electrical Characteristics @T_A = 25°C unless otherwise specified
Type
Number
MMSZ5263B
Type
Code
M8
Zener Voltage Range (Note 3)
Nom (V)
56
V_Z @ I_ZT
Min (V)
53.20
Max (V)
58.80
Test
Current
I_ZT
mA
2.2
Maximum Zener
Impedance (Note 5)
Z_ZT @ I_ZT
Z_ZK @ I_ZK
= 0.25mA
Ω
150
1300
Maximum Reverse
Leakage Current (Note 3)
I_R
@ V_R
μA
V
0.1
43
Notes:
1. Device mounted on FR-4 substrate, single-sided, PC boards, with minimum recommended pad layout.
2. Thermal Resistance measurement obtained via infrared scan method.
3. Short duration pulse test used to minimize self-heating effect.
4. No purposefully added lead. Halogen and Antimony Free.
5. f = 1KHz.
MMSZ5263B
Document number: DS31652 Rev. 4 - 2
1 of 3
www.diodes.com
September 2009
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