MMSZ5221B_09 Datasheet, PDF (1/5 Pages) Taiwan Semiconductor Company, Ltd – 500mW, 5% Tolerance SMD Zener Diode

Features
• 500mW Power Dissipation
• General Purpose, Medium Current
• Ideally Suited for Automated Assembly Processes
• Lead, Halogen and Antimony Free, RoHS Compliant (Note 3)
• "Green" Device (Note 4)
• Qualified to AEC-Q101 Standards for High Reliability
MMSZ5221B - MMSZ5259B
500mW SURFACE MOUNT ZENER DIODE
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Mechanical Data
• Case: SOD-123
• Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
• Polarity: Cathode Band
• Ordering Information: See Page 3
• Marking Information: See Page 3
• Weight: 0.01 grams (approximate)
Top View
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Forward Voltage
@ I_F = 10mA
V_F
0.9
V
Thermal Characteristics
Characteristic
Power Dissipation (Note 1) @T_L = 75°C
Thermal Resistance, Junction to Ambient Air (Note 1)
Thermal Resistance, Junction to Lead (Note 2)
Operating and Storage Temperature Range
Symbol
P_D
R_θJA
R_θJL
T_J, T_STG
Value
500
350
150
-65 to +150
Unit
mW
°C/W
°C/W
°C
Notes:
1. Device mounted on FR-4 substrate, single-sided, PC boards, with minimum recommended pad layout.
2. Thermal Resistance measurement obtained via infrared scan method.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb₂O₃ Fire Retardants.
MMSZ5221B - MMSZ5259B
Document number: DS18010 Rev. 23 - 2
1 of 5
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May 2009
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