MMDT5551_1 Datasheet, PDF (1/4 Pages) Diodes Incorporated – DUAL NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR

SPICE MODEL: MMDT5551
MMDT5551
DUAL NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
· Epitaxial Planar Die Construction
· Complementary PNP Type Available (MMDT5401)
· Ideal for Medium Power Amplification and Switching
· Ultra-Small Surface Mount Package
· Lead Free/RoHS Compliant (Note 3)
Mechanical Data
· Case: SOT-363
· Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
· Moisture Sensitivity: Level 1 per J-STD-020C
· Terminals: Solderable per MIL-STD-202, Method 208
· Lead Free Plating (Matte Tin Finish annealed
over Alloy 42 leadframe).
· Terminal Connections: See Diagram
· Marking (See Page 2): K4N
· Ordering & Date Code Information: See Page 2
· Weight: 0.006 grams (approx.)
A
C₂
B₁
E₁
BC
E₂
B₂
C₁
G
H
K
J
DF
L
C₂
B₁
E₁
E₂
B₂
C₁
SOT-363
Dim Min Max
A
0.10 0.30
B
1.15 1.35
C
2.00 2.20
D
0.65 Nominal
F
0.30 0.40
M
H
1.80 2.20
J
¾
0.10
K
0.90 1.00
L
0.25 0.40
M
0.10 0.25
a
0°
8°
All Dimensions in mm
Maximum Ratings ^{@ T}A ^{= 25°C unless otherwise specified}
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current - Continuous (Note 1)
Power Dissipation (Note 1, 2)
Thermal Resistance, Junction to Ambient (Note 1)
Operating and Storage and Temperature Range
Symbol
V_CBO
V_CEO
V_EBO
I_C
P_d
RqJA
T_j, T_STG
Value
180
160
6.0
200
200
625
-55 to +150
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Maximum combined dissipation.
3. No purposefully added lead.
Unit
V
V
V
mA
mW
°C/W
°C
DS30172 Rev. 7 - 2
1 of 4
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MMDT5551
ã Diodes Incorporated