MMDT4146_09 Datasheet, PDF (1/5 Pages) Diodes Incorporated – COMPLEMENTARY NPN / PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR

MMDT4146
Features
COMPLEMENTARY NPN / PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Please click here to visit our online spice models database.
Mechanical Data
• Complementary Pair
One 4124-Type NPN
One 4126-Type PNP
• Epitaxial Planar Die Construction
• Ideal for Medium Power Amplification and Switching
• Ultra-Small Surface Mount Package
• Lead Free/RoHS Compliant (Note 3)
• "Green" Device (Note 4 and 5)
• Case: SOT-363
• Case Material: Molded Plastic, “Green” Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating) Solderable per MIL-STD-202, Method 208
• Terminal Connections: See Diagram
• Marking Information: See Page 4
• Ordering Information: See Page 4
• Weight: 0.006 grams (approximate)
C₂
B₁
E₁
E1, B1, C1 = PNP4126 Section
E2, B2, C2 = NPN4124 Section
Top View
E₂
B₂
C₁
Device Schematic
Maximum Ratings, NPN 4124 Section @T_A = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Collector-Base Voltage
V_CBO
30
V
Collector-Emitter Voltage
V_CEO
25
V
Emitter-Base Voltage
V_EBO
5.0
V
Collector Current – Continuous
(Note 1)
I_C
200
mA
Maximum Ratings, PNP 4126 Section @T_A = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Collector-Base Voltage
V_CBO
-25
V
Collector-Emitter Voltage
V_CEO
-25
V
Emitter-Base Voltage
V_EBO
-4
V
Collector Current - Continuous
(Note 1)
I_C
-200
mA
Thermal Characteristics – Total Device
Characteristic
Power Dissipation
Thermal Resistance, Junction to Ambient
(Note 1, 2)
(Note 1)
Symbol
P_D
R_θJA
Value
200
625
Unit
mW
°C/W
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Maximum combined dissipation.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
MMDT4146
Document number: DS30162 Rev. 11 - 2
1 of 5
www.diodes.com
January 2009
© Diodes Incorporated