MMDT3904_2 Datasheet, PDF (1/4 Pages) Diodes Incorporated – DUAL NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR

MMDT3904
DUAL NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
• Epitaxial Planar Die Construction
• Ideal for Low Power Amplification and Switching
• Ultra-Small Surface Mount Package
• Lead Free/RoHS Compliant (Note 2)
• "Green" Device (Note 3 and 4)
A
C₂
B₁
E₁
BC
Mechanical Data
E₂
B₂
C₁
• Case: SOT-363
H
• Case Material: Molded Plastic. UL Flammability
K
Classification Rating 94V-0
M
• Moisture Sensitivity: Level 1 per J-STD-020C
• Terminals: Solderable per MIL-STD-202, Method 208
J
DF
L
• Lead Free Plating (Matte Tin Finish annealed over
Alloy 42 leadframe).
C₂
B₁
E₁
• Terminal Connections: See Diagram
• Marking Information: See Page 4
• Ordering Information: See Page 4
• Weight: 0.006 grams (approximate)
E₂
B₂
C₁
SOT-363
Dim Min Max
A
0.10 0.30
B
1.15 1.35
C
2.00 2.20
D
0.65 Nominal
F
0.30 0.40
H
1.80 2.20
J
—
0.10
K
0.90 1.00
L
0.25 0.40
M
0.10 0.25
α
0°
8°
All Dimensions in mm
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current - Continuous
Power Dissipation
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
(Note 1)
V_CBO
V_CEO
V_EBO
I_C
P_d
R_θJA
T_j, T_STG
60
40
6.0
200
200
625
-55 to +150
V
V
V
mA
mW
°C/W
°C
Notes:
1. Device mounted on FR-4 PCB; pad layout as shown on Diodes Inc. suggested pad layout documents APO2001,
which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30088 Rev. 14 - 2
1 of 4
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MMDT3904
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