MMBZ5221B_10 Datasheet, PDF (1/5 Pages) Diodes Incorporated – 350mW SURFACE MOUNT ZENER DIODE

MMBZ5221B - MMBZ5259B
350mW SURFACE MOUNT ZENER DIODE
Features
• Planar Die Construction
• 350mW Power Dissipation on FR-4 PCB
• General Purpose, Medium Current
• Ideally Suited for Automated Assembly Processes
• Lead, Halogen and Antimony Free, RoHS Compliant "Green"
Device (Notes 2 and 3)
• Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
• Case: SOT-23
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminal Connections: See Diagram
• Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
• Marking Information: See Page 4
• Ordering Information: See Page 4
• Weight: 0.008 grams (approximate)
Top View
Device Schematic
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Forward Voltage @ I_F = 10mA
Symbol
Value
Unit
V_F
0.9
V
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Symbol
P_D
R_θJA
T_J, T_STG
Value
350
357
-65 to +150
Unit
mW
°C/W
°C
Notes:
1. Mounted on FR4 PC Board with recommended pad layout which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf
2. No purposefully added lead. Halogen and Antimony Free.
3. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code
V9 are built with Non-Green Molding Compound and may contain Halogens or Sb₂O₃ Fire Retardants.
MMBZ5221B - MMBZ5259B
Document number: DS18011 Rev. 21 - 2
1 of 5
www.diodes.com
August 2010
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