MMBZ5221BW_09 Datasheet, PDF (1/5 Pages) Diodes Incorporated – 200mW SURFACE MOUNT ZENER DIODE

Features
• Planar Die Construction
• Ultra-Small Surface Mount Package
• General Purpose
• Ideally Suited for Automated Assembly Processes
• Lead Free/RoHS Compliant (Note 2)
• Qualified to AEC-Q101 Standards for High Reliability
• "Green" Device (Notes 3 and 4)
MMBZ5221BW - MMBZ5259BW
200mW SURFACE MOUNT ZENER DIODE
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Mechanical Data
• Case: SOT-323
• Case Material: Molded Plastic, "Green" Molding Compound
(Note 4). UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
• Polarity: See Diagram
• Marking Information: See Page 3
• Ordering Information: See Page 3
• Weight: 0.006 grams (approximate)
Top View
Device Schematic
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Forward Voltage
@ I_F = 10mA
V_F
0.9
V
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Symbol
P_D
R_θJA
T_J, T_STG
Value
200
625
-65 to +150
Unit
mW
°C/W
°C
Notes:
1. Mounted on FR4 PC Board with recommended pad layout which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" Policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with date code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to date
code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
MMBZ5221BW - MMBZ5259BW
Document number: DS31037 Rev. 13 - 2
1 of 5
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April 2009
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