MMBZ5221BTS_08 Datasheet, PDF (1/4 Pages) Diodes Incorporated – TRIPLE SURFACE MOUNT ZENER DIODE ARRAY

Features
• Three Isolated Zeners in Ultra-Small Surface Mount Package
• Ideally Suited for Automated Assembly Processes
• Lead Free/RoHS Compliant (Note 3)
• Qualified to AEC-Q101 Standards for High Reliability
• "Green" Device (Note 4 and 5)
MMBZ5221BTS - MMBZ5259BTS
TRIPLE SURFACE MOUNT ZENER DIODE ARRAY
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Mechanical Data
• Case: SOT-363
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
• Orientation: See Diagram
• Marking Information: See Page 3
• Ordering Information: See Page 3
• Weight: 0.006 grams (approximate)
C₁
C₂
C₃
Top View
A₁
A₂
A₃
Package Pin Configuration
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Forward Voltage
(Note 2) @ I_{F =} 10mA
V_F
0.9
V
Thermal Characteristics
Characteristic
Power Dissipation
Thermal Resistance, Junction to Ambient Air
Operating and Storage Temperature Range
(Note 1)
(Note 1)
Symbol
P_D
R_θJA
T_J, T_STG
Value
200
625
-65 to +150
Unit
mW
°C/W
°C
Notes:
1. Mounted on FR4 PC Board with recommended pad layout which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
MMBZ5221BTS - MMBZ5259BTS
Document number: DS30184 Rev. 12 - 2
1 of 4
www.diodes.com
June 2008
© Diodes Incorporated