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MMBZ5221BS_15 Datasheet, PDF (1/4 Pages) Diodes Incorporated – 200mW SURFACE MOUNT ZENER DIODE
Features
• Planar Die Construction
• Dual Isolated Zeners in Ultra-Small Surface Mount Package
• Ideally Suited for Automated Assembly Processes
• Lead Free/RoHS Compliant (Note 2)
• "Green" Device (Note 3 and 4)
MMBZ5221BS - MMBZ5259BS
200mW SURFACE MOUNT ZENER DIODE
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Mechanical Data
• Case: SOT-363
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
• Polarity: See Diagram
• Marking Information: See Page 4
• Ordering Information: See Page 4
• Weight: 0.006 grams (approximate)
C1
NC
A2
Top View
A1
NC
C2
Device Schematic
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Forward Voltage
@ IF = 10mA
VF
0.9
V
Thermal Characteristics
Characteristic
Power Dissipation
Thermal Resistance, Junction to Ambient Air
Operating and Storage Temperature Range
(Note 1)
(Note 1)
Symbol
PD
RθJA
TJ, TSTG
Value
200
625
-65 to +150
Unit
mW
°C/W
°C
Notes:
1. Mounted on FR4 PC Board with recommended pad layout which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
MMBZ5221BS - MMBZ5259BS
Document number: DS31039 Rev. 15 - 2
1 of 4
www.diodes.com
June 2008
© Diodes Incorporated