MMBZ15VDL_1 Datasheet, PDF (1/4 Pages) Diodes Incorporated – 40W PEAK POWER DUAL SURFACE MOUNT TVS

MMBZ15VDL, MMBZ27VCL
40W PEAK POWER DUAL SURFACE MOUNT TVS
Features
· Dual TVS in Common Cathode Configuration for ESD Protection
· 40 Watt Peak Power Dissipation @1.0ms (Unidirectional)
· 225 mW Power Dissipation
· Ideally Suited for Automatic Insertion
· Low Leakage
· Lead Free/RoHS Compliant (Note 4)
· Qualified to AEC-Q101 Standards for High Reliability
A
BC
Mechanical Data
TOP VIEW
E
D
G
· Case: SOT-23
H
· Case Material: Molded Plastic. UL Flammability Rating
Classification 94V-0
K
M
· Moisture Sensitivity: Level 1 per J-STD-020C
· Terminals: Solderable per MIL-STD-202, Method 208
J
L
· Lead Free Plating (Matte Tin Finish annealed
over Alloy 42 leadframe).
· Polarity: See Diagram
· Date Code: See Page 3
· Marking Code: See Table Below
· Weight: 0.008 grams (approximate)
SOT-23
Dim Min Max
A
0.37 0.51
B
1.20 1.40
C
2.30 2.50
D
0.89 1.03
E
0.45 0.60
G
1.78 2.05
H
2.80 3.00
J 0.013 0.10
K 0.903 1.10
L
0.45 0.61
M 0.085 0.180
a
0°
8°
All Dimensions in mm
Maximum Ratings ^{@TA = 25°C unless otherwise specified}
Characteristic
Power Dissipation (Note 1)
Peak Power Dissipation (Note 2)
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Symbol
Pd
P_PK
RqJA
T_j ,T_STG
Value
225
40
556
–65 to +150
Unit
mW
W
°C/W
°C
Electrical Characteristics ^{@TA = 25°C unless otherwise specified}
V_F = 0.9V max @ I_F = 10mA (Note 3)
Type
Number
Marking
Code
V_RWM
Volts
IR @
V_RWM
nA
MMBZ15VDL
KVJ
12.8
100
V_F = 1.1V max @ I_F = 200mA (Note 3)
Breakdown Voltage
VBR (Note 3) (V)
Min
Nom
Max
14.3
15
15.8
@ IT
mA
1.0
V_C @ I_PP (Note 2)
VC
IPP
V
A
21.2
1.9
Typical
Temperature
Coefficient
T_C (%/°C)
+0.080
Type
Number
Marking
Code
V_RWM
Volts
IR @
V_RWM
nA
Breakdown Voltage
VBR (Note 3) (V)
Min
Nom
Max
@ IT
mA
V_C @ I_PP (Note 2)
VC
IPP
V
A
Typical
Temperature
Coefficient
T_C (%/°C)
MMBZ27VCL
KVP
22
50
25.65
27
28.35
1.0
38
1.0
+0.090
Note:
1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes Inc. suggested pad layout AP02001,
which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 200mW per element must not be
exceeded.
2. Non-repetitive current pulse per Figure 2 and derate above TA = 25°C per Figure 1.
3. Short duration test pulse used to minimize self-heating effect.
4. No purposefully added lead.
DS30352 Rev. 9 - 2
1 of 4
MMBZ15VDL, MMBZ27VCL
www.diodes.com
ã Diodes Incorporated