MMBD4448V_08 Datasheet, PDF (1/2 Pages) Diodes Incorporated – SURFACE MOUNT FAST SWITCHING DIODE

Features
• Ultra-Small Surface Mount Package
• Fast Switching Speed
• For General Purpose Switching Applications
• High Conductance
• Lead Free By Design/RoHS Compliant (Note 4)
• "Green" Device (Note 5 and 6)
MMBD4448V
SURFACE MOUNT FAST SWITCHING DIODE
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Mechanical Data
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SOT-563
Case: SOT-563
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Finish - Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.003 grams (approximate)
C₁ NC A₂
TOP VIEW
BOTTOM VIEW
A₁ NC C₂
TOP VIEW
Internal Schematic
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Non-Repetitive Peak Reverse Voltage
V_RM
100
V
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V_RRM
V_RWM
80
V
V_R
RMS Reverse Voltage
V_R(RMS)
57
V
Forward Continuous Current (Note 2)
I_FM
500
mA
Average Rectified Output Current (Note 2)
I_O
250
mA
Non-Repetitive Peak Forward Surge Current
@ t = 1.0μs
@ t = 1.0s
I_FSM
4.0
2.0
A
Thermal Characteristics
Characteristic
Power Dissipation (Note 2)
Thermal Resistance Junction to Ambient (Note 2)
Operating and Storage Temperature Range
Symbol
P_D
R_θJA
T_J , T_STG
Value
150
833
-65 to +150
Unit
mW
°C/W
°C
Electrical Characteristics @T_A = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 3)
Forward Voltage
Leakage Current (Note 3)
Total Capacitance
Reverse Recovery Time
Symbol
V_(BR)R
V_F
Min
80
0.62
⎯
⎯
⎯
I_R
⎯
C_T
⎯
t_rr
⎯
Max
⎯
0.72
0.855
1.0
1.25
100
50
30
25
3.5
4.0
Unit
V
V
nA
μA
μA
nA
pF
ns
Test Condition
I_R = 2.5μA
I_F = 5.0mA
I_F = 10mA
I_F = 100mA
I_F = 150mA
V_R = 70V
V_R = 75V, T_J = 150°C
V_R = 25V, T_J = 150°C
V_R = 20V
V_R = 6V, f = 1.0MHz
V_R = 6V, I_F = 5mA
Notes:
1. Package is non-polarized. Parts may be on reel in orientation illustrated, 180° rotated, or mixed (both ways).
2. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. Short duration pulse test used to minimize self-heating effect.
4. No purposefully added lead.
5. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
6. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb₂O₃ Fire Retardants.
MMBD4448V
Document number: DS30451 Rev. 7 - 2
1 of 2
www.diodes.com
March 2008
© Diodes Incorporated