MMBD3004BRM_15 Datasheet, PDF (1/3 Pages) Diodes Incorporated – HIGH VOLTAGE SURFACE MOUNT SWITCHING DIODE ARRAY

MMBD3004BRM
HIGH VOLTAGE SURFACE MOUNT SWITCHING DIODE ARRAY
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Features
Mechanical Data
• Two Series Diode Circuits Connect to Form Full Wave Bridge
• Fast Switching Speed
• High Conductance
• High Reverse Breakdown Voltage Rating
• Lead Free/RoHS Compliant Version (Note 3)
• "Green" Device (Notes 4 and 5)
• Case: SOT-26
• Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Copper
leadframe).
• Polarity: See Diagram
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.016 grams (approximate)
SOT-26
AC
C₁
C₂
1
TOP VIEW
A₁
A₂
AC
2
TOP VIEW
Internal Schematic
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Repetitive Peak Reverse Voltage
V_RRM
350
V
Working Peak Reverse Voltage
DC Blocking Voltage
V_RWM
300
V
V_R
RMS Reverse Voltage
V_R(RMS)
212
V
Forward Continuous Current (Note 1)
I_F
225
mA
Peak Repetitive Forward Current (Note 1)
I_FRM
625
mA
Non-Repetitive Peak Forward Surge Current
@ t = 1.0μs
@ t = 1.0s
I_FSM
4.0
1.0
A
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Thermal Resistance Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Symbol
P_D
R_θJA
T_J , T_STG
Value
350
357
-65 to +150
Unit
mW
°C/W
°C
Electrical Characteristics @T_A = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 2)
Forward Voltage
Reverse Current (Note 2)
Total Capacitance
Reverse Recovery Time
Symbol Min Typ Max
V_(BR)R 350 ⎯
⎯
0.78 0.87
V_F
⎯ 0.93 1.0
1.03 1.25
I_R
30 100
⎯ _{35 100}
C_T
⎯ 1.0 5.0
t_rr
⎯ ⎯ 50
Unit
Test Condition
V
I_R = 150μA
I_F = 20mA
V
I_F = 100mA
I_F = 200mA
nA V_R = 240V
μA V_R = 240V, T_J = 150°C
pF V_R = 0V, f = 1.0MHz
ns
I_F = I_R = 30mA,
I_rr = 3.0mA, R_L = 100Ω
Notes:
1. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product
manufactured prior to Date Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
MMBD3004BRM
Document number: DS30387 Rev. 8 - 2
1 of 3
www.diodes.com
March 2008
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