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DZT658 Datasheet, PDF (1/3 Pages) Diodes Incorporated – NPN SURFACE MOUNT TRANSISTOR | |||
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DZT658
Features
NPN SURFACE MOUNT TRANSISTOR
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⢠Epitaxial Planar Die Construction
⢠Ideally Suited for Automated Assembly Processes
⢠Ideal for Medium Power Switching or Amplification Applications
⢠Lead Free By Design/RoHS Compliant (Note 1)
⢠"Green" Device (Note 2)
Mechanical Data
⢠Case: SOT-223
⢠Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
⢠Moisture Sensitivity: Level 1 per J-STD-020C
⢠Terminals: Finish â Matte Tin annealed over Copper Leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
⢠Marking Information: See Page 3
⢠Ordering Information: See Page 3
⢠Weight: 0.115 grams
3
2
1
4
SOT-223
3E
COLLECTOR
2,4
C4
2C
BASE 1
1B
TOP VIEW
3
EMITTER
Schematic and Pin Configuration
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Peak Pulse Current
Symbol
VCBO
VCEO
VEBO
IC
ICM
Value
400
400
5
0.5
1
Unit
V
V
V
A
A
Thermal Characteristics
Characteristic
Power Dissipation @TA = 25°C (Note 3)
Thermal Resistance, Junction to Ambient Air (Note 3) @TA = 25°C
Operating and Storage Temperature Range
Symbol
PD
RθJA
TJ, TSTG
Value
1
125
-55 to +150
Unit
W
°C/W
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
Off Characteristics
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Emitter-Base Breakdown Voltage
Collector Cutoff Current
Emitter Cutoff Current
On Characteristics (Note 4)
Collector-Emitter Saturation Voltage
Base-Emitter Saturation Voltage
Base-Emitter Turn-On Voltage
DC Current Gain
AC Characteristics
Transition Frequency
Output Capacitance
Switching Times
Symbol Min
V(BR)CBO
V(BR)CEO
V(BR)EBO
ICBO
IEBO
400
400
5
â¯
â¯
â¯
VCE(SAT)
â¯
â¯
VBE(SAT)
â¯
VBE(ON)
â¯
50
hFE
50
40
fT
50
Cobo
â¯
ton
â¯
toff
â¯
Typ
â¯
â¯
â¯
â¯
â¯
0.075
0.06
0.08
â¯
â¯
110
100
85
â¯
â¯
138
175
Max
â¯
â¯
â¯
100
100
0.3
0.25
0.5
0.9
1
â¯
â¯
â¯
â¯
10
â¯
â¯
Unit Test Condition
V IC = 100μA, IE = 0
V IC = 10mA, IB = 0
V IE = 100μA, IC = 0
nA VCB = 320V, IE = 0
nA VEB = 4V, IC = 0
V IC = 20mA, IB = 1mA
V IC = 50mA, IB = 5mA
V IC = 100mA, IB = 10mA
V IC = 100mA, IB = 10mA
V VCE = 5V, IC = 100mA
VCE = 5V, IC = 1mA
⯠VCE = 5V, IC = 100mA
VCE = 10V, IC = 200mA
MHz
pF
ns
ns
VCE = 20V, IC = 30mA, f = 30MHz
VCB = 20V, f = 1MHz
VCC = 100V, IC = 100mA
IB1 = 10mA, IB2 = -20mA
Notes: 1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Device mounted on FR-4 PCB, pad layout as shown on page 3 or in Diodes Inc. suggested pad layout document AP02001,
which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
4. Pulse Test: Pulse width â¤300μs. Duty cycle â¤2.0%.
DS31308 Rev. 2 - 2
1 of 3
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DZT658
© Diodes Incorporated
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