|
DZT5551 Datasheet, PDF (1/4 Pages) Diodes Incorporated – NPN SURFACE MOUNT TRANSISTOR | |||
|
DZT5551
NPN SURFACE MOUNT TRANSISTOR
Features
⢠Epitaxial Planar Die Construction
⢠Complementary PNP Type Available (DZT5401)
⢠Ideally Suited for Automated Assembly Processes
⢠Ideal for Medium Power Switching or Amplification Applications
⢠Lead Free By Design/RoHS Compliant (Note 1)
⢠"Green" Device (Note 3)
Mechanical Data
⢠Case: SOT-223
⢠Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
⢠Moisture Sensitivity: Level 1 per J-STD-020C
⢠Terminals: Finish - Matte Tin annealed over Copper Leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
⢠Terminal Connections: See Diagram
⢠Marking & Type Code Information: See Page 3
⢠Ordering Information: See Page 3
⢠Weight: 0.112 grams (approximate)
3
2
1
4
SOT-223
3E
COLLECTOR
2,4
C4
2C
1B
TOP VIEW
1
BASE
3
EMITTER
Schematic and Pin Configuration
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Symbol
VCBO
VCEO
VEBO
IC
Value
180
160
6.0
600
Unit
V
V
V
mA
Thermal Characteristics
Characteristic
Power Dissipation @TA = 25°C (Note 3)
Thermal Resistance, Junction to Ambient @TA = 25°C (Note 3)
Operating and Storage Temperature Range
Symbol
PD
RθJA
Tj, TSTG
Value
1
125
-55 to +150
Unit
W
°C/W
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS (Note 4)
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Emitter-Base Breakdown Voltage
Collector Cutoff Current
Emitter Cutoff Current
ON CHARACTERISTICS (Note 4)
DC Current Gain
Collector-Emitter Saturation Voltage
Base-Emitter Saturation Voltage
SMALL SIGNAL CHARACTERISTICS
Output Capacitance
Small Signal Current Gain
Current Gain-Bandwidth Product
Noise Figure
Symbol
V(BR)CBO
V(BR)CEO
V(BR)EBO
ICBO
IEBO
hFE
VCE(SAT)
VBE(SAT)
Min
180
160
6.0
â¯
â¯
80
80
30
â¯
â¯
Cobo
â¯
hfe
50
fT
100
NF
â¯
Max
â¯
â¯
â¯
50
50
â¯
250
â¯
0.15
0.20
1.0
6.0
200
300
8.0
Unit
Test Condition
V IC = 100μA, IE = 0
V IC = 1.0mA, IB = 0
V IE = 10μA, IC = 0
nA VCB = 120V, IE = 0
μA VCB = 120V, IE = 0, TA = 100°C
nA VEB = 4.0V, IC = 0
IC = 1.0mA, VCE = 5.0V
⯠IC = 10mA, VCE = 5.0V
IC = 50mA, VCE = 5.0V
V IC = 10mA, IB = 1.0mA
IC = 50mA, IB = 5.0mA
V IC = 10mA, IB = 1.0mA
IC = 50mA, IB = 5.0mA
pF
â¯
MHz
dB
VCB = 10V, f = 1.0MHz, IE = 0
VCE = 10V, IC = 1.0mA, f = 1.0kHz
VCE = 10V, IC = 10mA, f = 100MHz
VCE = 5.0V, IC = 200μA, RS = 1.0kΩ, f = 1.0kHz
Notes: 1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Device mounted on FR-4 PCB, pad layout as shown on page 4 or in Diodes Inc. suggested pad layout document AP02001, which can be found on our
website at http://www.diodes.com/datasheets/ap02001.pdf.
4. Measured under pulsed conditions. Pulse width = 300μs. Duty cycle ⤠2%.
DS31219 Rev. 2 â 2
1 of 4
www.diodes.com
DZT5551
© Diodes Incorporated
|
▷ |