DZQA5V6AXV5 Datasheet, PDF (1/3 Pages) Diodes Incorporated – QUAD SURFACE MOUNT TVS ARRAY

Features
• Quad TVS in Common Anode Configuration
• Ultra-Small Surface Mount Package
• Ideal For Transient Suppression and ESD Protection
• Lead Free By Design/RoHS Compliant (Note 1)
• "Green Device" (Note 2)
• Qualified to AEC-Q101 Standards for High Reliability
ESD Capability
• IEC 61000-4-2 Contact Method ±8kV
• IEC 61000-4-2 Air Discharge Method ±15kV
DZQA5V6AXV5
QUAD SURFACE MOUNT TVS ARRAY
Please click here to visit our online spice models database.
Mechanical Data
• Case: SOT-553
• Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminal Finish: Matte Tin, Annealed Over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
• Polarity: Pin 1 Indicator
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.002g (approx.)
A1/A2
C2 A3/A4 C1
3
2
1
D2
D1
D3
D4
4
5
C3
C4
Device Schematic
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Forward Voltage @ I_F = 10mA
Symbol
Value
Unit
V_F
0.9
V
Thermal Characteristics
Characteristic
Power Dissipation (Notes 4, 7)
Peak Power Dissipation, 8x20μS Waveform (Note 5)
Thermal Resistance, Junction-to-Ambient (Note 4)
Operating and Storage Temperature Range
Symbol
P_D
P_pk
R_θJA
T_J, T_STG
Value
380
20
327
-55 to +150
Unit
mW
W
°C/W
°C
Electrical Characteristics @T_A = 25°C unless otherwise specified
Type
Number
Marking
Code
DZQA5V6AXV5 T56
Breakdown Voltage
(Note 3)
V_BR @ I_T = 1mA
Min (V) Nom (V) Max (V)
5.3
5.6
5.9
Leakage Current
(Note 3)
I_RM @ V_RM
Max(μA)
(V)
1
3.0
Clamping
Voltage
(Note 5)
V_C @ I_PP
V_C(V) I_PP(A)
13
1.6
Typ Capacitance
@0V Bias(pF)
(Note 6)
C_T
Typ
Max
18.7
20
Typ Capacitance
@3V Bias(pF)
(Note 6)
C_T
Typ
Max
11.4 12.3
Notes:
1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Short duration pulse test used to minimize self-heating effect.
4. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. Suggested Pad Layout Document AP02001,
which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
5. Non-repetitive current pulse per Figure 3 and derate above T_A = 25°C per Figure 1.
6. Per element, f = 1MHZ, T_A = 25°C
7. Only 1 diode under power. For all 4 diodes under power, P_D will be 25% of the listed value.
DZQA5V6AXV5
Document number: DS31557 Rev. 3 - 2
1 of 3
www.diodes.com
March 2009
© Diodes Incorporated