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DMP2012SN_0711 Datasheet, PDF (1/4 Pages) Diodes Incorporated – P-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR | |||
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DMP2012SN
P-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR
Features
⢠Low On-Resistance
⢠Low Gate Threshold Voltage
⢠Low Input Capacitance
⢠Fast Switching Speed
⢠Lead Free By Design/RoHS Compliant (Note 2)
⢠ESD Protected Gate
⢠"Green" Device (Note 4)
⢠Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
â¢
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SC-59
Case: SC-59
Case Material: Molded Plastic, âGreenâ Molding
Compound. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Finish â Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
Terminal Connections: See Diagram
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.008 grams (approximate)
Drain
D
ESD protected
TOP VIEW
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Drain-Source Voltage
Gate-Source Voltage
Drain Current (Note 1) Steady State
Pulsed Drain Current (Note 3)
Gate
Gate
Protection
Diode
Source
Equivalent Circuit
G
S
TOP VIEW
Symbol
VDSS
VGSS
ID
IDM
Value
-20
±12
-0.7
-2.8
Unit
V
V
A
A
Thermal Characteristics @TA = 25°C unless otherwise specified
Characteristic
Total Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
Symbol
Pd
RθJA
Tj, TSTG
Value
500
250
-65 to +150
Unit
mW
°C/W
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS (Note 5)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Symbol Min
BVDSS
-20
IDSS
â¯
IGSS
â¯
VGS(th)
RDS (ON)
-0.5
â¯
Typ
â¯
â¯
â¯
â¯
0.23
0.37
Max Unit
â¯
V
-10
μA
±10
μA
-1.2
V
0.30
0.50
Ω
Forward Transfer Admittance
Diode Forward Voltage (Note 5)
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
SWITCHING CHARACTERISTICS
Turn-On Delay Time
Turn-Off Delay Time
Turn-On Rise Time
Turn-Off Fall Time
|Yfs|
â¯
VSD
â¯
Ciss
â¯
Coss
â¯
Crss
â¯
tD(ON)
â¯
tD(OFF)
â¯
tr
â¯
tf
â¯
1.5
â¯
S
-0.8
-1.1
V
180
â¯
pF
120
â¯
pF
50
â¯
pF
5
â¯
ns
55
â¯
ns
20
â¯
ns
70
â¯
ns
Notes:
1. Device mounted on FR-4 PCB.
2. No purposefully added lead.
3. Pulse width â¤10μS, Duty Cycle â¤1%.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Short duration pulse test used to minimize self-heating effect.
Test Condition
VGS = 0V, ID = 250mA
VDS = -20V, VGS = 0V
VGS = ±12V, VDS = 0V
VDS = VGS, ID = -250μA
VGS = -4.5V, ID = -0.4A
VGS = -2.5V, ID = -0.4A
VDS = -10V, ID = 0.4A
VGS = 0V, IS = -0.7A
VDS = -10V, VGS = 0V
f = 1.0MHz
VDD = -10V, ID = -0.4A,
VGS = -5.0V, RGEN = 50Ω
DMP2012SN
Document number: DS30790 Rev. 3 - 2
1 of 4
www.diodes.com
November 2007
© Diodes Incorporated
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