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DMP2004VK Datasheet, PDF (1/5 Pages) Diodes Incorporated – DUAL P-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR | |||
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DMP2004VK
DUAL P-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR
Features
⢠Dual P-Channel MOSFET
⢠Low On-Resistance
⢠Very Low Gate Threshold Voltage VGS(TH) <1V
⢠Low Input Capacitance
⢠Fast Switching Speed
⢠Low Input/Output Leakage
⢠Lead Free By Design/RoHS Compliant (Note 2)
⢠ESD Protected Gate
⢠"Green" Device (Note 3)
Mechanical Data
⢠Case: SOT-563
⢠Case Material: Molded Plastic, âGreenâ Molding Compound.
UL Flammability Classification Rating 94V-0
⢠Moisture Sensitivity: Level 1 per J-STD-020
⢠Terminal Connections: See Diagram
⢠Terminals: Finish - Matte Tin annealed over Copper lead frame.
Solderable per MIL-STD-202, Method 208
⢠Marking Information: See Page 3
⢠Ordering Information: See Page 3
⢠Weight: 0.006 grams (approximate)
SOT-563
D2
G1
S1
ESD protected
TOP VIEW
BOTTOM VIEW
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 1) VGS = -4.5V
Pulsed Drain Current
Symbol
VDSS
VGSS
ID
IDM
S2
G2
D1
TOP VIEW
Internal Schematic
Value
-20
±8
-530
-1.8
Units
V
V
mA
A
Thermal Characteristics @TA = 25°C unless otherwise specified
Characteristic
Total Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient, Note 1
Operating and Storage Temperature Range
Symbol
PD
RθJA
TJ, TSTG
Value
400
312.5
-65 to +150
Units
mW
°C/W
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS (Note 4)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage (Note 4)
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Symbol Min
Typ
Max
Unit
Test Condition
BVDSS
-20
IDSS
â¯
IGSS
â¯
â¯
â¯
V VGS = 0V, ID = -250mA
â¯
-1.0
μA VDS = -20V, VGS = 0V
â¯
±1.0
μA VGS = ±4.5V, VDS = 0V
VGS(th)
-0.5
â¯
-1.0
V
VDS = VGS, ID = -250μA
0.7
0.9
VGS = -4.5V, ID = -430mA
RDS (ON)
â¯
1.1
1.4
1.7
2.0
Ω VGS = -2.5V, ID = -300mA
VGS = -1.8V, ID = -150mA
|Yfs|
200
â¯
â¯
mS VDS = -10V, ID = -0.2A
VSD
-0.5
â¯
-1.2
V VGS = 0V, IS = 115mA
Ciss
â¯
Coss
â¯
Crss
â¯
â¯
175
pF
â¯
30
pF
VDS = -16V, VGS = 0V
f = 1.0MHz
â¯
20
pF
Notes:
1. Device mounted on FR-4 PCB.
2. No purposefully added lead.
3. Diodes Inc.âs âGreenâ policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Short duration pulse test used to minimize self-heating effect.
DMP2004VK
Document number: DS30916 Rev. 4 - 2
1 of 5
www.diodes.com
June 2010
© Diodes Incorporated
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