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DMN2600UFB Datasheet, PDF (1/6 Pages) Diodes Incorporated – N-CHANNEL ENHANCEMENT MODE MOSFET | |||
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Features
⢠Low On-Resistance
⢠Low Gate Threshold Voltage
⢠Fast Switching Speed
⢠Ultra-Small Surface Mount Package
⢠Lead Free By Design/RoHS Compliant (Note 1)
⢠"Green" Device (Note 2)
⢠ESD Protected Gate 1kV
⢠Qualified to AEC-Q101 Standards for High Reliability
DMN2600UFB
N-CHANNEL ENHANCEMENT MODE MOSFET
Mechanical Data
⢠Case: DFN1006-3
⢠Case Material: Molded Plastic, âGreenâ Molding Compound.
UL Flammability Classification Rating 94V-0
⢠Moisture Sensitivity: Level 1 per J-STD-020
⢠Terminal Connections: See Diagram
⢠Terminals: Finish â NiPdAu over Copper leadframe. Solderable
per MIL-STD-202, Method 208
⢠Marking Information: See Page 5
⢠Ordering Information: See Page 5
⢠Weight: 0.001 grams (approximate)
ESD PROTECTED TO 1kV
DFN1006-3
Bottom View
S
D
G
Top View
Internal Schematic
Drain
Gate
Body
Diode
Gate
Protection
Diode
Source
Equivalent Circuit
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 3)
Steady
State
Pulsed Drain Current
TA = 25°C
TA = 85°C
Symbol
VDSS
VGSS
ID
IDM
Value
25
±8
1.3
0.9
3.0
Unit
V
V
A
A
Thermal Characteristics @TA = 25°C unless otherwise specified
Characteristic
Power Dissipation (Note 3)
Thermal Resistance, Junction to Ambient @TA = 25°C
Operating and Storage Temperature Range
Symbol
PD
RθJA
TJ, TSTG
Value
0.54
234
-55 to +150
Notes:
1. No purposefully added lead
2. Diodes Inc's "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php
3. Device mounted on FR-4 substrate PCB board, with minimum recommended pad layout.
Unit
W
°C/W
°C
DMN2600UFB
Document number: DS31983 Rev. 3 - 2
1 of 6
www.diodes.com
July 2010
© Diodes Incorporated
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