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DMN2004DWK_0711 Datasheet, PDF (1/4 Pages) Diodes Incorporated – DUAL N-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR
DMN2004DWK
DUAL N-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR
Features
• Dual N-Channel MOSFET
• Low On-Resistance
• Low Gate Threshold Voltage
• Low Input Capacitance
• Fast Switching Speed
• Low Input/Output Leakage
• Ultra-Small Surface Mount Package
• Lead Free By Design/RoHS Compliant (Note 2)
• ESD Protected up to 2KV
• "Green" Device (Note 4)
• Qualified to AEC-Q101 standards for High Reliability
Mechanical Data
• Case: SOT-363
• Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
• Terminal Connections: See Diagram
• Terminals: Finish - Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
• Marking Information: See Page 4
• Ordering Information: See Page 4
• Weight: 0.006 grams (approximate)
CASE
D2
G1
S1
ESD protected up to 2kV
TOP VIEW
Maximum Ratings @TA = 25°C unless otherwise specified
Drain-Source Voltage
Characteristic
Gate-Source Voltage
Drain Current (Note 1)
Steady
State
Pulsed Drain Current (Note 3)
TA = 25°C
TA = 85°C
S2
G2
D1
TOP VIEW
Internal Schematic
Symbol
VDSS
VGSS
ID
IDM
Value
20
±8
540
390
1.5
Thermal Characteristics @TA = 25°C unless otherwise specified
Characteristic
Total Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
Symbol
Pd
RθJA
Tj, TSTG
Value
200
625
-65 to +150
Units
V
V
mA
A
Units
mW
°C/W
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS (Note 5)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Symbol
Min
Typ
Max
Unit
BVDSS
20
⎯
⎯
V
IDSS
⎯
⎯
1
μA
IGSS
⎯
⎯
±1
μA
VGS(th)
0.5
⎯
1.0
V
0.4
0.55
RDS (ON)
⎯
0.5
0.70
Ω
0.7
0.9
Forward Transfer Admittance
Diode Forward Voltage (Note 5)
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
|Yfs|
200
⎯
⎯
ms
VSD
0.5
⎯
1.4
V
Ciss
⎯
Coss
⎯
Crss
⎯
⎯
150
pF
⎯
25
pF
⎯
20
pF
Notes:
1. Device mounted on FR-4 PCB.
2. No purposefully added lead.
3. Pulse width ≤10μS, Duty Cycle ≤1%.
4. Diodes Inc.’s “Green” policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Short duration pulse test used to minimize self-heating effect.
DMN2004DWK
Document number: DS30935 Rev. 3 - 2
1 of 4
www.diodes.com
Test Condition
VGS = 0V, ID = 10μA
VDS = 16V, VGS = 0V
VGS = ±4.5V, VDS = 0V
VDS = VGS, ID = 250μA
VGS = 4.5V, ID = 540mA
VGS = 2.5V, ID = 500mA
VGS = 1.8V, ID = 350mA
VDS =10V, ID = 0.2A
VGS = 0V, IS = 115mA
VDS = 16V, VGS = 0V
f = 1.0MHz
November 2007
© Diodes Incorporated