DLPT05_08 Datasheet, PDF (1/4 Pages) Diodes Incorporated – SURFACE MOUNT DATALINE PROTECTION DEVICE

Features
• 300 Watts Peak Pulse Power (tp = 8x20μs)
• Transient Protection for data line to IEC61000-4-2 level 4
(ESD), 8kV HBM
Contact: Discharge – ±30kV
Air: Discharge – ±30kV
• IEC 61000-4-4 (EFT)
• Low Leakage Current
• Surface Mount Package Ideally Suited for Automated Insertion
• Lead, Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 4 and 5)
DLPT05
SURFACE MOUNT DATALINE PROTECTION DEVICE
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Mechanical Data
• Case: SOT-23
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
• Terminal Connections: See Diagram
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.008 grams (approximate)
GROUND
TVS
Top View
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Peak Pulse Power (tp = 8x20μs)
Peak Forward Voltage (I_PP = 1A, tp = 8x20μs)
Diode Peak Repetitive Reverse Voltage
LINE TO
V_CC
BE PROTECTED
Device Schematic
Symbol
P_PK
V_FP
V_RRM
Value
300
2.1
75
Unit
W
V
V
Thermal Characteristics
Characteristic
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
Symbol
R_θJA
T_J, T_STG
Value
417
-55 to +150
Unit
°C/W
°C
Electrical Characteristics @T_A = 25°C unless otherwise specified
Reverse
Standoff
Voltage
V_RWM (V)
5
Breakdown Voltage
V_BR @ I_T
Min (V) Max (V)
6.0
⎯
Test
Current
I_T (mA)
1.0
Max. Reverse
Leakage @ V_RWM
I_R (μA)
20
Max. Clamping
Voltage @ I_pp = 1A
(Note 3)
V_C (V)
9.8
Max. Peak Pulse
Current (Note 2)
(A)
17
Typical Total
Capacitance
(pF)
1.9
Notes:
1. V_R = 0V, f = 1MHz from line to be protected to ground pin.
2 . tp = 8x20μs.
3. Clamping voltage value is based on an 8x20μs peak pulse current (I_pp) waveform.
4. No purposefully added lead. Halogen and Antimony Free.
5. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured
prior to Date Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb₂O₃ Fire Retardants.
DLPT05
Document number: DS30310 Rev. 9 - 2
1 of 4
www.diodes.com
July 2008
© Diodes Incorporated