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DLPA006_08 Datasheet, PDF (1/4 Pages) Diodes Incorporated – DATA BUS TRANSIENT SUPPRESSOR / 3-PHASE FULL WAVE BRIDGE RECTIFIER
DLPA006
DATA BUS TRANSIENT SUPPRESSOR / 3-PHASE FULL WAVE BRIDGE RECTIFIER
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Features
Mechanical Data
• Fast Switching Speed
• Ultra-Small Surface Mount Package
• Ideal For Three Dataline Rail Clamp or Three Phase Full Wave
Bridge Rectification
• Lead Free By Design/RoHS Compliant (Note 4)
• "Green" Device (Note 5)
Data Line Transient Protection
In accordance with (Note 1):
• IEC 61000-4-2 Contact Method: ±15kV
• IEC 61000-4-2 Air Discharge Method: ±25kV
• Case: SOT-363
• Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0 (Note 4)
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Finish ⎯ Matte Tin annealed over Alloy 42
Leadframe. Solderable per MIL-STD-202, Method 208
• Ordering Information: See Page 2
• Marking Information: See Page 2
• Weight: 0.006 grams (approximate)
/ / / AC3 DC+ DC+
DL3 VCC VCC
SOT-363
TOP VIEW
/ / / DL1 GND DL2
AC1 DC- AC2
TOP VIEW
Internal Schematic
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
85
V
VR
RMS Reverse Voltage
VR(RMS)
60
V
Forward Current (Single Diode)
IFM
160
mA
Non-Repetitive Peak Forward Surge Current
@ t = 1.0μs
4.0
@ t = 1.0ms
IFSM
1.0
A
@ t = 1.0s
0.5
Thermal Characteristics
Characteristic
Power Dissipation (Note 2)
Power Dissipation (Note 3)
Thermal Resistance Junction to Ambient Air (Note 2)
Thermal Resistance Junction to Ambient Air (Note 3)
Operating and Storage Temperature Range
Symbol
PD
PD
RθJA
RθJA
TJ, TSTG
Value
200
300
625
417
-65 to +150
Unit
mW
mW
°C/W
°C/W
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 6)
Forward Voltage
Leakage Current (Note 6)
Total Capacitance (per element)
Capacitance Between Two Data Lines (DL1 & DL2, DL1 & DL3)
Capacitance Between Data Line and Ground
Reverse Recovery Time
Symbol Min Typ Max Unit
Test Condition
V(BR)R
85
⎯
⎯
V IR = 100μA
0.90
IF = 1.0mA
VF
⎯
⎯
1.0
1.1
V IF = 10mA
IF = 50mA
1.25
IF = 150mA
IR
⎯
⎯
5.0
80
nA VR = 75V
nA VR = 75V, TJ = 150°C
CT
⎯
2
⎯
pF VR = 0, f = 1.0MHz
CLL
⎯
1.6
2.6
pF VR = 0, f = 1.0MHz
CLG
⎯
2.5
3.5
pF VR = 0, f = 1.0MHz
trr
⎯
⎯
3.0
μs
IF = IR = 10mA,
Irr = 0.1 x IR, RL = 100Ω
Notes:
1. Tested with VCC pins connected to GND pin.
2. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. Device mounted on Alumina PCB, 0.4 inch x 0.3 inch x 0.024 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
4. No purposefully added lead.
5. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
6. Short duration pulse test used to minimize self-heating.
DLPA006
Document number: DS30665 Rev. 8 - 2
1 of 4
www.diodes.com
October 2008
© Diodes Incorporated