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DFLZ5V1_09 Datasheet, PDF (1/4 Pages) Diodes Incorporated – 1.0W SURFACE MOUNT POWER ZENER DIODE
Features
• 1W Power Dissipation on FR-4 PCB
• Lead Free Finish, RoHS Compliant (Note 2)
• "Green" Molding Compound (No Br, Sb)
• Qualified to AEC-Q101 Standards for High Reliability
DFLZ5V1 - DFLZ39
1.0W SURFACE MOUNT POWER ZENER DIODE
PowerDI®123
Mechanical Data
• Case: PowerDI®123
• Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminal Connections: Cathode Band
• Terminals: Finish - Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
• Marking Information: See Page 3
• Ordering Information: See Page 3
• Weight: 0.01 grams (approximate)
Top View
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Forward Voltage
@ IF = 200mA
VF
1.2
V
Thermal Characteristics
Characteristic
Symbol
Typ
Value
Power Dissipation (Note 1)
Thermal Resistance Junction to Ambient Air (Note 1)
Thermal Resistance Junction to Soldering Point (Note 3)
Operating and Storage Temperature Range
PD
RθJA
RθJS
TJ, TSTG
—
1.0
110
—
—
9
—
-55 to +150
Notes:
1. Device mounted on 1" x 1", FR-4 PCB; 2 oz. Cu pad layout as shown on Diodes Inc. suggested pad layout document AP02001.pdf.
2. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.
3. Theoretical RθJS calculated from the top center of the die straight down to the PCB/cathode tab solder junction.
Unit
W
°C/W
°C/W
°C
PowerDI is a registered trademark of Diodes Incorporated.
DFLZ5V1 - DFLZ39
Document number: DS30464 Rev. 8 - 2
1 of 4
www.diodes.com
January 2009
© Diodes Incorporated