DFLU1400_1 Datasheet, PDF (1/3 Pages) Diodes Incorporated – 1.0A SURFACE MOUNT SUPER-FAST RECTIFIER

DFLU1400
1.0A SURFACE MOUNT SUPER-FAST RECTIFIER
PowerDI ^®123
Features
• Glass Passivated Die Construction
• Super-Fast Recovery Time for High Efficiency
• Low Forward Voltage Drop and High Current Capability
• Patented Interlocking Clip Design for High Surge Current
D
Capacity
H
• Lead Free Finish, RoHS Compliant (Note 2)
A
• "Green" Molding Compound (No Br, Sb)
• Qualified to AEC-Q101 Standards for High Reliability
B
Mechanical Data
• Case: PowerDI^®123
• Case Material: Molded Plastic, "Green" Molding
Compound. UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
• Terminal Connections: Cathode Band
• Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
• Marking & Type Code Information: See Page 3
• Ordering Information: See Page 3
• Weight: 0.011 grams (approximate)
C
E
L
L1
L
E
L2
L4
L3
A
PowerDI^®123
Dim Min Max Typ
A 3.50 3.90 3.70
B 2.60 3.00 2.80
C 1.63 1.93 1.78
D 0.93 1.00 0.98
E 0.85 1.25 1.00
H 0.15 0.25 0.20
L 0.45 0.85 0.65
L1 — — 1.35
L2 — — 1.10
L3 — — 0.20
L4 0.90 1.30 1.05
All Dimensions in mm
Maximum Ratings and Electrical Characteristics @T_A = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage (Note 5)
V_RRM
V_RWM
400
V
V_R
RMS Reverse Voltage
V_R(RMS)
280
V
Average Rectified Output Current
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
I_O
1.0
A
I_FSM
30
A
Maximum Forward Voltage Drop
@I_F = 1.0A
V_FM
1.25
V
Peak Reverse Current
at Rated DC Blocking Voltage (Note 5)
@T_A = 25°C
@T_A = 100°C
I_RM
5.0
200
μA
Maximum Reverse Recovery Time (Note 4)
t_rr
25
ns
Typical Total Capacitance (f = 1MHz, V_R = 4VDC)
C_T
14
pF
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
@T_A = 25°C
Thermal Resistance Junction to Ambient (Note 1) @T_A = 25°C
Thermal Resistance Junction to Soldering Point (Note 3)
Operating and Storage Temperature Range
Symbol
P_D
R_θJA
R_θJS
T_j, T_STG
Typ
Max
⎯
1.0
117
⎯
⎯
6
-65 to +150
Notes:
1. Device mounted on 1" x 1", Polymide PCB; 2 oz. Cu pad layout as shown on Diodes Inc. suggested pad layout document AP02001.pdf.
2. RoHS revision 13.2.2003. Glass and high temperature solder exemptions applied, see EU Directive Annex Notes 5 and 7.
3. Theoretical R_θJS calculated from the top center of the die straight down to the PCB cathode tab solder junction.
4. Measured with I_F = 0.5A, I_R = 1.0A, I_rr = 0.25A. See figure 5.
5. Short duration pulse test used to minimize self-heating effect.
6. Device mounted on FR-4 PCB, 2oz. Cu pad layout as shown on Diodes Inc. suggested pad layout document AP02001.pdf. (see page 2)
Unit
W
°C/W
°C/W
°C
DS30784 Rev. 2 - 2
PowerDI is a registered trademark of Diodes Incorporated.
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DFLU1400
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