DFLU1200 Datasheet, PDF (1/3 Pages) Diodes Incorporated – 1.0A SURFACE MOUNT SUPER-FAST RECTIFIER

SPICE MODEL: DFLU1200
DFLU1200
1.0A SURFACE MOUNT SUPER-FAST RECTIFIER
PowerDI ^ä123
Features
· Glass Passivated Die Construction
· Super-Fast Recovery Time for High Efficiency
· Low Forward Voltage Drop and High Current Capability
· Lead Free Finish, RoHS Compliant (Note 2)
· Green Molding Compound (No Br, Sb)
· Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
· Case: PowerDI^ä123
· Case Material: Molded Plastic, "Green" Molding
Compound. UL Flammability Classification Rating
94V-0
· Moisture sensitivity: Level 1 per J-STD-020C
· Terminal Connections: Cathode Band
· Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202,
Method 208 e3
· Marking & Type Code Information: See Last Page
· Ordering Information: See Last Page
· Weight: 0.01 grams (approximate)
D
H
A
B
C
E
L
L1
L
E
L2
L4
L3
A
PowerDI^ä123
Dim Min Max Typ
A 3.50 3.90 3.70
B 2.60 3.00 2.80
C 1.63 1.93 1.78
D 0.93 1.00 0.98
E 0.85 1.25 1.00
H 0.15 0.25 0.20
L 0.45 0.85 0.65
L1 —
— 1.35
L2 —
— 1.10
L3 —
— 0.20
L4 0.90 1.30 1.05
All Dimensions in mm
Maximum Ratings and Electrical Characteristics ^TA ^{= 25°C unless otherwise specified}
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Symbol
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V_RRM
VRWM
V_R
RMS Reverse Voltage
V_R(RMS)
Average Rectified Output Current
I_O
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
I_FSM
Forward Voltage Drop (Note 5)
@ I_F = 0.6A
@ I_F = 1.0A
V_FM
Peak Reverse Current
at Rated DC Blocking Voltage (Note 5)
@ T_A = 25°C
@ T_A = 100°C
IRM
Reverse Recovery Time (Note 4)
t_rr
Typical Total Capacitance (f = 1MHz, V_R = 4VDC)
C_T
Operating and Storage Temperature Range
T_j, T_STG
DFLU1200
Unit
200
V
140
V
1.0
A
30
A
0.90
0.98
V
5.0
200
mA
25
ns
27
pF
-65 to +150
°C
Thermal Characteristics ^{@ TA = 25°C unless otherwise specified}
Characteristic
Symbol
Typ
Max
Power Dissipation (Note 1)
PD
¾
1.0
Thermal Resistance Junction to Ambient (Note 1)
RqJA
116
¾
Thermal Resistance Junction to Soldering (Note 3)
RqJS
¾
6
Notes:
1. Device mounted on 1" x 1", Polymide PCB; 2 oz. Cu pad layout as shown on Diodes Inc. suggested pad layout document AP02001.pdf.
2. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
3. Theoretical RqJS calculated from the top center of the die straight down to the PCB cathode tab solder junction.
4. Measured with IF = 0.5A, IR = 1.0A, Irr = 0.25A. See figure 5.
5. Short duration pulse test to minimize self-heating effect.
Unit
W
°C/W
°C/W
DS30601 Rev. 2 - 2
PowerDI is a trademark of Diodes Incorporated.
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DFLU1200
ã Diodes Incorporated