DFLS230_15 Datasheet, PDF (1/3 Pages) Diodes Incorporated – 2.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER PowerDI 123

DFLS230
2.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
PowerDI ^ä123
Features
· Guard Ring Die Construction for
Transient Protection
· Low Power Loss, High Efficiency
· Patented Interlocking Clip Design for High Surge Current
Capacity
D
H
· Low Forward Voltage Drop
· Lead Free Finish, RoHS Compliant (Note 5)
A
· "Green" Molding Compound (No Br, Sb)
B
PowerDI^ä123
Dim Min Max Typ
A 3.50 3.90 3.70
B 2.60 3.00 2.80
C 1.63 1.93 1.78
D 0.93 1.00 0.98
Mechanical Data
C
E
· Case: PowerDI^ä123
· Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
L
L1
L
· Moisture Sensitivity: Level 1 per J-STD-020C
· Terminal Connections: Cathode Band
E
L2
· Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208 e3
· Marking & Type Code Information: See Last Page
L4
L3
A
· Ordering Information: See Last Page
· Weight: 0.01 grams (approximate)
E 0.85 1.25 1.00
H 0.15 0.25 0.20
L 0.45 0.85 0.65
L1 — — 1.35
L2 — — 1.10
L3 — — 0.20
L4 0.90 1.30 1.05
All Dimensions in mm
Maximum Ratings ^{@ T}A ^{= 25°C unless otherwise specified}
Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Forward Current @ TT = 120°C
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
Power Dissipation (Note 1)
Power Dissipation (Note 2)
Thermal Resistance Junction to Ambient (Note 1)
Thermal Resistance Junction to Ambient (Note 2)
Thermal Resistance Junction to Soldering (Note 3)
Operating Temperature Range
Storage Temperature Range
Symbol
V_RRM
V_RWM
V_R
V_R(RMS)
I_F(AV)
I_FSM
P_D
P_D
RqJA
R_qJA
RqJS
T_j
T_STG
Value
30
21
2.0
40
1.67
556
60
180
10
-55 to +125
-55 to +150
Unit
V
V
A
A
W
mW
°C/W
°C/W
°C/W
°C
°C
Electrical Characteristics ^{@ T}A ^{= 25°C unless otherwise specified}
Characteristic
Reverse Breakdown Voltage (Note 4)
Forward Voltage
Leakage Current (Note 4)
Total Capacitance
Symbol Min
V_(BR)R
30
V_F
¾
¾
I_R
¾
C_T
¾
Typ
¾
0.36
0.4
0.15
75
Max Unit
Test Condition
¾
V IR = 1.5mA
0.42
0.49
V
IF = 1.0A
IF = 2.0A
1.0
mA VR = 30V, TA = 25°C
¾
pF VR = 10V, f = 1.0MHz
Notes:
1. Part mounted on 50.8mm X 50.8mm GETEK board with 25.4mm X 25.4mm copper pad, 25% anode, 75% cathode. TA = 25°C
2. Part mounted on FR-4 board with 1.8mm X 2.5mm cathode and 1.8mm X 1.2mm anode, 1 oz. copper pads. TA = 25°C
3. Theoretical RqJS calculated from the top center of the die straight down to the PCB cathode tab solder junction.
4. Short duration pulse test to minimize self-heating effect.
5. RoHS revision 13.2.2003. High Temperature Solder Exemption Applied, see EU Directive Annex Note 7.
DS30518 Rev. 2 - 1
PowerDI is a trademark of Diodes Incorporated.
1 of 3
www.diodes.com
DFLS230
ã Diodes Incorporated