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DFLS230LH_08 Datasheet, PDF (1/3 Pages) Diodes Incorporated – 2.0A HIGH EFFICIENCY SCHOTTKY BARRIER RECTIFIER | |||
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Features
⢠Guard Ring Die Construction for Transient Protection
⢠Low Power Loss, High Efficiency
⢠Low VF and Low Leakage Current
⢠Patented Interlocking Clip Design for High Surge Current
Capacity
⢠Lead Free Finish, RoHS Compliant (Note 4)
⢠"Green" Molding Compound (No Br, Sb)
⢠Qualified to AEC-Q101 Standards for High Reliability
DFLS230LH
2.0A HIGH EFFICIENCY SCHOTTKY BARRIER RECTIFIER
PowerDI®123
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Mechanical Data
⢠Case: PowerDI®123
⢠Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
⢠Moisture Sensitivity: Level 1 per J-STD-020D
⢠Terminal Connections: Cathode Band
⢠Terminals: Finish â Matte Tin annealed over Copper
Leadframe. Solderable per MIL-STD-202, Method 208
⢠Marking Information: See Page 2
⢠Ordering Information: See Page 2
⢠Weight: 0.01 grams (approximate)
Top View
Maximum Ratings @TA = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Forward Current
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
Symbol
VRRM
VRWM
VR
VR(RMS)
IF(AV)
IFSM
Value
30
21
2.0
75
Unit
V
V
A
A
Thermal Characteristics
Characteristic
Thermal Resistance Junction to Soldering Point (Note 2)
Operating Temperature Range
Storage Temperature Range
Symbol
RθJS
TJ
TSTG
Typ
Max
â¯
6
-65 to +150
-65 to +150
Unit
°C/W
°C
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 3)
Forward Voltage
Leakage Current (Note 3)
Total Capacitance
Symbol Min
V(BR)R
30
VF
â¯
â¯
IR
â¯
â¯
CT
â¯
Typ
Max Unit
Test Condition
â¯
â¯
V IR = 200μA
â¯
â¯
0.45
0.375
V IF = 2A, TJ = 25°C
IF = 2A, TJ = 125°C
â¯
6
0.200
15
mA VR = 30V, TJ = 25°C
VR = 30V, TJ = 100°C
85
â¯
pF VR = 10V, f = 1.0MHz
Notes:
1. Part mounted on FR-4 board with 2 oz., minimum recommended copper pad layout, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf. TA = 25°C
2. Theoretical RθJS calculated from the top center of the die straight down to the PCB/cathode tab solder junction.
3. Short duration pulse test used to minimize self-heating effect.
4. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.
PowerDI is a registered trademark of Diodes Incorporated.
DFLS230LH
Document number: DS30583 Rev. 4 - 2
1 of 3
www.diodes.com
May 2008
© Diodes Incorporated
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