DFLS230 Datasheet, PDF (1/3 Pages) Diodes Incorporated – 2.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER

SPICE MODEL: DFLS230
DFLS230
Features
2.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
PowerDI ^ä123
· Guard Ring Die Construction for
Transient Protection
· Low Power Loss, High Efficiency
· High Surge Capability
D
· High Current Capability and Low Forward Voltage Drop
H
· Lead Free Finish, RoHS Compliant (Note 5)
A
· "Green" Molding Compound (No Br, Sb)
Mechanical Data
B
· Case: PowerDI^ä123
C
E
· Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
· Moisture sensitivity: Level 1 per J-STD-020C
L
L1
L
· Terminal Connections: Cathode Band
· Terminals: Finish – Matte Tin annealed over Copper
E
leadframe. Solderable per MIL-STD-202, Method 208 e3
· Marking & Type Code Information: See Last Page
L2
L4
L3
A
· Weight: 0.01 grams (approx.)
· Ordering Information: See Last Page
PowerDI^ä123
Dim Min Max Typ
A 3.50 3.90 3.70
B 2.60 3.00 2.80
C 1.63 1.93 1.78
D 0.93 1.00 0.98
E 0.85 1.25 1.00
H 0.15 0.25 0.20
L 0.45 0.85 0.65
L1 — — 1.35
L2 — — 1.10
L3 — — 0.20
L4 0.90 1.30 1.05
All Dimensions in mm
Maximum Ratings ^{@ T}A ^{= 25°C unless otherwise specified}
Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Forward Current @ T_T = 120°C
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
(JEDEC Method)
Power Dissipation (Note 1)
Power Dissipation (Note 2)
Thermal Resistance Junction to Ambient (Note 1)
Thermal Resistance Junction to Ambient (Note 2)
Thermal Resistance Junction to Soldering (Note 3)
Operating Temperature Range
Storage Temperature Range
Symbol
VRRM
V_RWM
VR
V_R(RMS)
I_F(AV)
IFSM
P_D
P_D
R_qJA
R_qJA
R_qJS
T_j
TSTG
Value
30
21
2.0
22
1.67
556
60
180
10
-55 to +125
-55 to +150
Unit
V
V
A
A
W
mW
°C/W
°C/W
°C/W
°C
°C
Electrical Characteristics ^{@ T}A ^{= 25°C unless otherwise specified}
Characteristic
Reverse Breakdown Voltage (Note 4)
Forward Voltage (Note 4)
Leakage Current (Note 4)
Total Capacitance
Symbol Min
V_(BR)R
¾
V_F
¾
¾
IR
¾
C_T
¾
Typ
¾
0.36
0.4
0.15
75
Max
¾
0.42
0.49
1.0
¾
Unit
V
V
mA
pF
Test Condition
IR = 1.5mA
I_F = 1.0A
I_F = 2.0A
VR = 30V, TA = 25°C
VR = 10V, f = 1.0MHz
Notes:
1. Part mounted on 50.8mm X 50.8mm GETEK board with 25.4mm X 25.4mm copper pad, 25% anode, 75% cathode.
2. Part mounted on FR-4 board with 1.8mm X 2.5mm cathode and 1.8mm X 1.2mm anode, 1 oz. copper pads.
3. Theoretical R_qJS calculated from the top center of the die straight down to the PCB cathode tab solder junction.
4. Short duration pulse test to minimize self-heating effect.
5. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
DS30518 Rev. 1 - 1
PowerDI is a trademark of Diodes Incorporated.
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DFLS230
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