DFLS160_08 Datasheet, PDF (1/3 Pages) Diodes Incorporated – 1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER

Features
• Guard Ring Die Construction for Transient Protection
• Low Power Loss, High Efficiency
• Patented Interlocking Clip Design for High Surge Current
Capacity
• Qualified to AEC-Q101 Standards for High Reliability
• Lead Free Finish, RoHS Compliant (Note 4)
• Green Molding Compound (No Br, Sb)
DFLS160
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
PowerDI^®123
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Mechanical Data
• Case: PowerDI^®123
• Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminal Connections: Cathode Band
• Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202 Method 208
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.01 grams (approximate)
Top View
Maximum Ratings @T_A = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V_RRM
V_RWM
60
V
V_R
RMS Reverse Voltage
V_R(RMS)
42
V
Average Forward Current
I_F(AV)
1.0
A
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
I_FSM
50
A
Thermal Characteristics
Characteristic
Thermal Resistance Junction to Soldering Point (Note 2)
Thermal Resistance Junction to Ambient (Note 1)
Operating and Storage Temperature Range
Symbol
R_θJS
R_θJA
T_J, T_STG
Typ
Max
⎯
6
125
⎯
-65 to +150
Unit
°C/W
°C/W
°C
Electrical Characteristics @T_A = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 3)
Forward Voltage
Leakage Current (Note 3)
Total Capacitance
Symbol
Min
Typ
Max Unit
Test Condition
V_(BR)R
60
⎯
⎯
V I_R = 0.2mA
V_F
⎯
⎯
0.50
V I_F = 1.0A
I_R
⎯
⎯
0.1
mA V_R = 60V, T_A = 25°C
C_T
⎯
67
⎯
pF V_R = 10V, f = 1.0MHz
Notes:
1. Part mounted on FR-4 board with 2 oz., minimum recommended copper pad layout, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
2. Theoretical R_θJS calculated from the top center of the die straight down to the PCB/cathode tab solder junction.
3. Short duration pulse test to minimize self-heating effect.
4. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.
PowerDI is a registered trademark of Diodes Incorporated.
DFLS160
Document number: DS30548 Rev. 4 - 2
1 of 3
www.diodes.com
September 2008
© Diodes Incorporated