DFLS1150_08 Datasheet, PDF (1/3 Pages) Diodes Incorporated – 1.0A HIGH VOLTAGE SCHOTTKY BARRIER RECTIFIER

Features
• Guard Ring Die Construction for Transient Protection
• Low Power Loss, High Efficiency
• Patented Interlocking Clip Design for High Surge Current
Capacity
• Lead Free Finish, RoHS Compliant (Note 4)
• "Green" Molding Compound (No Br, Sb)
• Qualified to AEC-Q101 Standards for High Reliability
DFLS1150
1.0A HIGH VOLTAGE SCHOTTKY BARRIER RECTIFIER
PowerDI^®123
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Mechanical Data
• Case: PowerDI^®123
• Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminal Connections: Cathode Band
• Terminals: Finish – Matte Tin annealed over Copper
Leadframe. Solderable per MIL-STD-202, Method 208
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.01 grams (approximate)
Top View
Maximum Ratings @T_A = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Forward Current
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
Symbol
V_RRM
V_RWM
V_R
V_R(RMS)
I_F(AV)
I_FSM
Value
150
106
1.0
50
Unit
V
V
A
A
Thermal Characteristics
Characteristic
Thermal Resistance Junction to Soldering Point (Note 2)
Thermal Resistance Junction to Ambient (Note 1)
Operating and Storage Temperature Range
Symbol
R_θJS
R_θJA
T_J, T_STG
Typ
Max
⎯
7
125
⎯
-55 to +175
Unit
°C/W
°C/W
°C
Electrical Characteristics @T_A = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 3)
Forward Voltage
Leakage Current (Note 3)
Total Capacitance
Symbol Min
Typ
Max
V_(BR)R
150
⎯
⎯
V_F
⎯
⎯
0.82
I_R
⎯
⎯
2
C_T
⎯
28
⎯
Unit
V
V
μA
pF
Test Condition
I_R = 2μA
I_F = 1.0A
V_R = 150V, T_A = 25°C
V_R = 5V_DC, f = 1MHz
Notes:
1. Part mounted on FR-4 board with 2 oz., minimum recommended copper pad layout, which can be found on our website
at http://www.diodes.com/datasheets/ap02001.pdf. T_A = 25°C
2. Theoretical R_θJS calculated from the top center of the die straight down to the PCB/cathode tab solder junction.
3. Short duration pulse test used to minimize self-heating effect.
4. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.
PowerDI is a registered trademark of Diodes Incorporated.
DFLS1150
Document number: DS30593 Rev. 6 - 2
1 of 3
www.diodes.com
May 2008
© Diodes Incorporated