DFLR1200 Datasheet, PDF (1/2 Pages) Diodes Incorporated – 1.0A SURFACE MOUNT GLASS PASSIVATED RECTIFIER

SPICE MODELS: DFLR1200 DFLR1400
DFLR1200 / DFLR1400
1.0A SURFACE MOUNT GLASS PASSIVATED RECTIFIER
PowerDI ^ä123
Features
· Qualified to AEC-Q101 Standards for High Reliability
· Ideally Suited for Automated Assembly
· Green Molding Compound (No Br, Sb)
· Lead Free Finish, RoHS Compliant (Note 2)
Mechanical Data
· Case: PowerDI^ä123
· Case Material: Molded Plastic, "Green" Molding
Compound. UL Flammability Classification Rating
94V-0
· Moisture sensitivity: Level 1 per J-STD-020C
· Terminal Connections: Cathode Band
· Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202,
Method 208 e3
· Marking & Type Code Information: See Last Page
· Ordering Information: See Last Page
· Weight: 0.01 grams (approx.)
D
H
A
B
C
E
L
L1
L
E
L2
L4
L3
A
PowerDI^ä123
Dim Min Max Typ
A 3.50 3.90 3.70
B 2.60 3.00 2.80
C 1.63 1.93 1.78
D 0.93 1.00 0.98
E 0.85 1.25 1.00
H 0.15 0.25 0.20
L 0.45 0.85 0.65
L1 —
— 1.35
L2 —
— 1.10
L3 —
— 0.20
L4 0.90 1.30 1.05
All Dimensions in mm
Maximum Ratings and Electrical Characteristics ^TA ^{= 25°C unless otherwise specified}
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave superimposed on rated load
Forward Voltage
@ I_F = 1.0A
Peak Reverse Leakage Current
at Rated DC Blocking Voltage
@ T_A = 25°C
@ T_A = 125°C
Typical Total Capacitance (f = 1MHz, V_R = 4.0VDC)
Operating and Storage Temperature Range
Symbol
V_RRM
VRWM
VR
V_R(RMS)
IO
IFSM
VFM
I_RM
CT
T_j, T_STG
DFLR1200
DFLR1400
200
400
140
280
1.0
25
1.1
3.0
100
10
-65 to +150
Thermal Characteristics ^{@ TA = 25°C unless otherwise specified}
Characteristic
Symbol
Typ
Max
Thermal Resistance, Junction to Ambient Air (Note 1)
RqJA
134
¾
Thermal Resistance, Junction to Soldering Point (Note 3)
R_qJS
¾
6
Notes:
1. Device mounted on 1" x 1", FR-4 PCB; 2 oz. Cu pad layout as shown on Diodes Inc. suggested pad layout document AP02001.pdf.
2. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
3. Theoretical RqJS calculated from the top center of the die straight down to the PCB/cathode tab solder junction.
Unit
V
V
A
A
V
mA
pF
°C
Unit
°C/W
°C/W
DS30602 Rev. 2 - 2
PowerDI is a trademark of Diodes Incorporated.
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DFLR1200 / DFLR1400
ã Diodes Incorporated