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DF01S-TF Datasheet, PDF (1/3 Pages) Diodes Incorporated – 1.0A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER
DF005S - DF10S
1.0A SURFACE MOUNT GLASS PASSIVATED BRIDGE
RECTIFIER
Features
· Glass Passivated Die Construction
· Low Forward Voltage Drop, High Current Capability
· Surge Overload Rating to 50A Peak
· Designed for Surface Mount Application
· UL Listed Under Recognized Component Index, File
Number E94661
· Lead Free Finish, RoHS Compliant (Date Code 0532+)
(Note 3)
Mechanical Data
L
AB
G
DE
DF-S
Dim Min Max
A
7.40 7.90
B
6.20 6.50
C
0.22 0.30
D 0.076 0.33
E
— 10.40
G
1.02 1.53
· Case: DF-S
· Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
H
J
· Moisture Sensitivity: Level 1 per J-STD-020C
· Terminals: Finish - Tin. Solderable per MIL-STD-202,
K
Method 208 e3
· Polarity: As marked on Case
· Marking: Type Number, See Page 3
· Weight: 0.38 grams (approximate)
H
8.13 8.51
C
J
2.40 2.60
K
5.00 5.20
L
1.00 1.20
All Dimensions in mm
Maximum Ratings and Electrical Characteristics @ TA = 25°C unless otherwise specified
Single phase, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Symbol
DF
005S
DF
01S
DF
02S
DF
04S
DF
06S
DF
08S
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRMM
VRWM
50
VR
100 200 400 600 800
RMS Reverse Voltage
VRMS
35
70
140 280 420 560
Average Forward Rectified Current
@ TA = 40°C IO
1.0
Non-Repetitive Peak Forward Surge Current, 8.3 ms
single half-sine-wave superimposed on rated load
IFSM
50
Forward Voltage (per element)
@ IF = 1.0A VFM
1.1
Peak Reverse Current at Rated
DC Blocking Voltage (per element)
@ TA = 25°C
@ TA = 125°C
IRM
10
500
I2t Rating for Fusing (t<8.3ms)
I2t
10.4
Typical Total Capacitance (per element) (Note 1)
CT
25
Typical Thermal Resistance, Junction to Ambient
(Note 2)
RqJA
40
Operating and Storage Temperature Range
Tj, TSTG
-65 to +150
DF
10S
Unit
1000
V
700
V
A
A
V
µA
A2s
pF
°C/W
°C
Notes:
1. Measured at 1.0 MHz and Applied Reverse Voltage of 4.0V DC.
2. Thermal resistance, junction to ambient, measured on PC board with 5.0mm2 (0.03mm thick) land areas.
3. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
DS17001 Rev. 13 - 2
1 of 3
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DF005S-DF10S
ã Diodes Incorporated