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DF005M_15 Datasheet, PDF (1/3 Pages) Diodes Incorporated – 1.0A GLASS PASSIVATED BRIDGE RECTIFIERS
Features
• Glass Passivated Die Construction
• Low Forward Voltage Drop, High Current Capability
• Surge Overload Rating to 50A Peak
• Designed for Printed Circuit Board Applications
• UL Listed Under Recognized Component Index, File
Number E94661
• Lead Free Finish, RoHS Compliant (Date Code 0532+)
(Note 3)
Mechanical Data
• Case: DF-M
J
• Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
L
• Terminals: Finish - Tin. Solder Plated Leads,
Solderable per MIL-STD-202, Method 208
• Polarity: As Marked on Case
• Marking Information: Type Number, See Page 3
• Weight: 0.38 grams (approximate)
DF005M - DF10M
1.0A GLASS PASSIVATED BRIDGE RECTIFIERS
C
DF-M
Dim Min Max
BA
A
7.40 7.90
E
B
6.20 6.50
C
0.22 0.30
D
1.27 2.03
H
E
7.60 8.90
D
G 3.81 4.69
H
8.13 8.51
G
J
2.40 3.40
K
5.00 5.20
K
L
0.46 0.58
All Dimensions in mm
Maximum Ratings and Electrical Characteristics @TA = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Symbol
DF
005M
DF
01M
DF
02M
DF
04M
DF
06M
DF
08M
DF
10M
Unit
VRMM
VRWM
50
100 200 400 600 800 1000 V
VR
RMS Reverse Voltage
VRMS
35
70 140 280 420 580 700 V
Average Rectified Output Current
@ TA = 40°C
IO
Non-Repetitive Peak Forward Surge Current, 8.3 ms
Single Half Sine-Wave Superimposed on Rated Load
IFSM
Forward Voltage (per element)
@ IF = 1.0 A VFM
Peak Reverse Current
at Rated DC Blocking Voltage (per element)
I2t Rating for Fusing (t<8.3ms)
@ TA = 25°C
@ TA = 125°C
IRM
I2t
1.0
A
50
A
1.1
V
10
500
µA
10.4
A2s
Typical Total Capacitance per element
(Note 1)
CT
25
Typical Thermal Resistance, Junction to Ambient
(Note 2) RθJA
40
Operating and Storage Temperature Range
Tj, TSTG
-65 to +150
Notes:
1. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
2. Thermal Resistance, junction to ambient, measured on PC board with 5.0mm2 (0.03mm thick) land areas.
3. RοHS revision 13.2.2003. Glass and high temperature solder exemptions applied, see EU Directive Annex Notes 5 and 7.
pF
°C/W
°C
DS21201 Rev. 15 - 2
1 of 3
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