DDTD113EU_1 Datasheet, PDF (1/3 Pages) Diodes Incorporated – NPN PRE-BIASED 500 mA SURFACE MOUNT TRANSISTOR

DDTD (xxxx) U
NPN PRE-BIASED 500 mA SURFACE MOUNT TRANSISTOR
Features
• Epitaxial Planar Die Construction
• Complementary PNP Types Available (DDTB)
• Built-In Biasing Resistors, R1, R2
• Lead Free/RoHS Compliant Version (Note 2)
• "Green" Device, Note 3 and 4
A
BC
Mechanical Data
• Case: SOT-323
G
• Case Material: Molded Plastic, "Green" Molding
H
Compound, Note 4. UL Flammability Classification
Rating 94V-0
K
M
• Moisture Sensitivity: Level 1 per J-STD-020C
• Terminals: Solderable per MIL-STD-202, Method 208
• Terminal Connections: See Diagram
J
• Lead Free Plating (Matte Tin Finish annealed over
DE
L
Alloy 42 leadframe).
• Marking Information: See Table Below & Page 3
OUT
• Ordering Information: See Page 3
3
• Weight: 0.006 grams (approximate)
C
P/N
DDTD113EU
DDTD123EU
DDTD143EU
DDTD114EU
DDTD122JU
DDTD113ZU
DDTD123YU
DDTD133HU
DDTD123TU
DDTD143TU
DDTD114TU
DDTD114GU
R1 (NOM)
1K
2.2K
4.7K
10K
0.22K
1K
2.2K
3.3K
2.2K
4.7K
10K
0
R2 (NOM)
1K
2.2K
4.7K
10K
4.7K
10K
10K
10K
OPEN
OPEN
OPEN
10K
MARKING
N60
N61
N62
N63
N64
N65
N66
N67
N69
N70
N71
N72
B ^R1
R2
E
1
2
IN
GND(0)
Schematic and Pin Configuration
SOT-323
Dim Min Max
A
0.25 0.40
B
1.15 1.35
C
2.00 2.20
D
0.65 Nominal
E
0.30 0.40
G
1.20 1.40
H
1.80 2.20
J
0.0 0.10
K
0.90 1.00
L
0.25 0.40
M
0.10 0.18
α
0°
8°
All Dimensions in mm
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Supply Voltage, (3) to (2)
Input Voltage, (1) to (2)
Input Voltage, (2) to (1)
Output Current
Power Dissipation
Thermal Resistance, Junction to Ambient Air
Operating and Storage Temperature Range
DDTD113EU
DDTD123EU
DDTD143EU
DDTD114EU
DDTD122JU
DDTD113ZU
DDTD123YU
DDTD133HU
DDTD123TU
DDTD143TU
DDTD114TU
DDTD114GU
All
(Note 1)
Symbol
V_CC
V_IN
V_{EBO (MAX)}
I_C
P_d
R_θJA
T_j, T_STG
Value
50
-10 to +10
-10 to +12
-10 to +30
-10 to +40
-5 to +5
-5 to +10
-5 to +12
-6 to +20
5
500
200
625
-55 to +150
Unit
V
V
V
mA
mW
°C/W
°C
Notes:
1. Mounted on FR4 PC Board with recommended pad layout at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to
Date Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30382 Rev. 7 - 2
1 of 3
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