DDTD113EC_09 Datasheet, PDF (1/4 Pages) Diodes Incorporated – NPN PRE-BIASED 500mA SURFACE MOUNT TRANSISTOR

Features
• Epitaxial Planar Die Construction
• Complementary PNP Types Available (DDTB)
• Built-In Biasing Resistors, R1, R2
• Lead, Halogen and Antimony Free, RoHS Compliant
• "Green" Device (Notes 2 and 3)
Part Number
DDTD113EC
DDTD123EC
DDTD143EC
DDTD114EC
DDTD122JC
DDTD113ZC
DDTD123YC
DDTD133HC
DDTD123TC
DDTD143TC
DDTD114TC
DDTD114GC
R1 (NOM)
1K
2.2K
4.7K
10K
0.22K
1K
2.2K
3.3K
2.2K
4.7K
10K
0
R2 (NOM)
1K
2.2K
4.7K
10K
4.7K
10K
10K
10K
OPEN
OPEN
OPEN
10K
Marking
N60
N61
N62
N63
N64
N65
N66
N67
N69
N70
N71
N72
DDTD (xxxx) C
NPN PRE-BIASED 500mA SURFACE MOUNT TRANSISTOR
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Mechanical Data
• Case: SOT-23
• Case Material: Molded Plastic, “Green” Molding Compound,
Note 3. UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminal Connections: See Diagram
• Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating) Solderable per MIL-STD-202, Method 208
• Marking Information: See Table and Page 3
• Ordering Information: See Page 3
• Weight: 0.008 grams (approximate)
OUT
3
C
B ^R1
R2
Top View
E
1
2
IN
GND(0)
Package Pin Out Configuration
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Supply Voltage, (3) to (2)
V_CC
50
V
Input Voltage, (1) to (2)
DDTD113EC
-10 to +10
DDTD123EC
-10 to +12
DDTD143EC
-10 to +30
DDTD114EC
DDTD122JC
V_IN
-10 to +40
-5 to +5
V
DDTD113ZC
-5 to +10
DDTD123YC
-5 to +12
DDTD133HC
-6 to +20
Input Voltage, (2) to (1)
DDTD123TC
DDTD143TC
DDTD114TC
V_EBO(MAX)
5
V
DDTD114GC
Output Current
All
I_C
500
mA
Thermal Characteristics
Characteristic
Power Dissipation
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Symbol
P_D
R_θJA
T_J, T_STG
Value
200
625
-55 to +150
Unit
mW
°C/W
°C
Notes:
1. Mounted on FR4 PC Board with recommended pad layout at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead. Halogen and Antimony Free.
3. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb₂O₃ Fire Retardants.
DDTD (xxxx) C
Document number: DS30384 Rev. 10 - 2
1 of 4
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January 2009
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