DDTC113TKA_2 Datasheet, PDF (1/3 Pages) Diodes Incorporated – NPN PRE-BIASED SMALL SIGNAL SURFACE MOUNT TRANSISTOR

DDTC (R1-ONLY SERIES) KA
NPN PRE-BIASED SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
• Epitaxial Planar Die Construction
• Complementary PNP Types Available (DDTA)
• Built-In Biasing Resistor, R1 only
• Lead Free/RoHS Compliant (Note 2)
• "Green" Device, Note 3 and 4
A
C
BC
Mechanical Data
B
E
G
• Case: SC-59
• Case Material: Molded Plastic, "Green" Molding Compound,
H
Note 4. UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
K
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Copper J
leadframe).
DF
• Terminal Connections: See Diagram
• Marking Information: See Diagrams & Page 3
• Ordering Information: See Page 3
R₁
B
• Weight: 0.008 grams (approximate)
L
C
P/N
DDTC113TKA
DDTC123TKA
DDTC143TKA
DDTC114TKA
DDTC124TKA
DDTC144TKA
DDTC115TKA
DDTC125TKA
R1 (NOM)
1KΩ
2.2KΩ
4.7KΩ
10KΩ
22KΩ
47KΩ
100KΩ
200KΩ
Type Code
N01
N03
N07
N12
N16
N19
N23
N25
E
SCHEMATIC DIAGRAM
SC-59
Dim Min Max
A
0.35 0.50
B
1.50 1.70
C
2.70 3.00
D
0.95
G
1.90
H
2.90 3.10
M
J
0.013 0.10
K
1.00 1.30
L
0.35 0.55
M
0.10 0.20
α
0°
8°
All Dimensions in mm
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Power Dissipation
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
V_CBO
V_CEO
V_EBO
I_C (Max)
P_d
R_θJA
T_j, T_STG
50
50
5
100
200
625
-55 to +150
V
V
V
mA
mW
°C/W
°C
Notes:
1. Mounted on FR4 PC Board with recommended pad layout at http://www.diodes.com/datasheets/ap02001.pdf
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to
Date Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30339 Rev. 6 - 2
1 of 3
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