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DDTA114GUA_2 Datasheet, PDF (1/3 Pages) Diodes Incorporated – PNP PRE-BIASED SMALL SIGNAL SURFACE MOUNT TRANSISTOR
DDTA (R2-ONLY SERIES) UA
PNP PRE-BIASED SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
• Epitaxial Planar Die Construction
• Complementary NPN Types Available (DDTC)
• Built-In Biasing Resistor, R2 only
• Lead Free/RoHS Compliant (Note 2)
• "Green" Device, (Note 3 and 4)
Mechanical Data
• Case: SOT-323
• Case Material: Molded Plastic, "Green" Molding
Compound, Note 4. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
• Terminal Connections: See Diagram
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over
Alloy 42 leadframe).
• Marking: Date Code and Type Code, See Page 3
• Type Code: See Table Below
• Ordering Information: See Page 3
• Weight: 0.006 grams (approximate)
B
K
J
B
A
C
BC
E
G
H
DE
L
C
R2
E
P/N
DDTA114GUA
DDTA124GUA
DDTA144GUA
DDTA115GUA
R2 (NOM)
10KΩ
22KΩ
47KΩ
100KΩ
Type Code
P26
P27
P28
P29
SCHEMATIC DIAGRAM
SOT-323
Dim Min Max
A
0.25 0.40
B
1.15 1.35
C
2.00 2.20
D
0.65 Nominal
E
0.30 0.40
G
1.20 1.40
M
H
1.80 2.20
J
0.0 0.10
K
0.90 1.00
L
0.25 0.40
M
0.10 0.18
α
0°
8°
All Dimensions in mm
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Symbol
VCBO
Value
-50
Unit
V
Collector-Emitter Voltage
VCEO
-50
V
Emitter-Base Voltage
VEBO
-5
V
Collector Current
IC (Max)
-100
mA
Power Dissipation
Pd
200
mW
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
RθJA
Tj, TSTG
625
-55 to +150
°C/W
°C
Notes:
1. Mounted on FR4 PC Board with recommended pad layout as shown on Diodes Inc., suggested pad layout document AP02001, which can be found on
our website at http://www.diodes.com/datasheets/ap02001.pdf
2. No purposefully added lead.
3. Diodes Inc.'s "Green" Policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with date code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to date
code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30328 Rev. 6 - 2
1 of 3
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