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DDC124EH_2 Datasheet, PDF (1/4 Pages) Diodes Incorporated – NPN PRE-BIASED SMALL SIGNAL DUAL SURFACE MOUNT TRANSISTOR
DDC (xxxx) H
NPN PRE-BIASED SMALL SIGNAL DUAL SURFACE MOUNT TRANSISTOR
Features
• Epitaxial Planar Die Construction
• Complementary PNP Types Available
(DDA)
• Built-In Biasing Resistors
• Lead Free By Design/RoHS Compliant (Note 3)
• "Green" Device (Note 4 and 5)
Mechanical Data
• Case: SOT-563
• Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
• Terminals: Finish - Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
• Terminal Connections: See Diagram
• Weight: 0.005 grams (approximate)
A
NXXYM B C
D
G
K
M
H
L
SEE NOTE 1
SOT-563
Dim Min Max Typ
A 0.15 0.30 0.25
B 1.10 1.25 1.20
C 1.55 1.70 1.60
D
0.50
G 0.90 1.10 1.00
H 1.50 1.70 1.60
K 0.56 0.60 0.60
L 0.15 0.25 0.20
M 0.10 0.18 0.11
All Dimensions in mm
P/N
DDC124EH
DDC144EH
DDC143EH
DDC114YH
DDC123JH
DDC114EH
DDC143TH
DDC114TH
R1
22KΩ
47KΩ
4.7KΩ
10KΩ
2.2KΩ
10KΩ
4.7KΩ
10KΩ
R2
22KΩ
47KΩ
4.7KΩ
47KΩ
47KΩ
10KΩ
⎯
⎯
MARKING
N17
N20
N08
N14
N06
N13
N07
N12
6 54
R1 R2
R2 R1
1
23
R1, R2
654
R1
R1
1
2
3
R1 Only
SCHEMATIC DIAGRAM, TOP VIEW
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Supply Voltage (6) to (1) and (3) to (4)
Input Voltage (2) to (1) and (5) to (4)
Output Current
Output Current
Power Dissipation
Thermal Resistance, Junction to Ambient Air
Operating and Storage Temperature Range
DDC124EH
DDC144EH
DDC143EH
DDC114YH
DDC123JH
DDC114EH
DDC143TH
DDC114TH
DDC124EH
DDC144EH
DDC143EH
DDC114YH
DDC123JH
DDC114EH
DDC143TH
DDC114TH
All
(Note 2)
VCC
VIN
IO
IC (Max)
Pd
RθJA
Tj, TSTG
50
-10 to +40
-10 to +40
-10 to +30
-6 to +40
-5 to +12
-10 to +40
-5V max
-5V max
30
30
100
70
100
50
100
100
100
150
833
-55 to +150
V
V
mA
mA
mW
°C/W
°C
Notes:
1. Package is non-polarized. Parts may be on reel in orientation illustrated, 180° rotated, or mixed (both ways).
2. Mounted on FR4 Board with recommended pad layout at http://www.diodes.com/datasheets/ap02001.pdf.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30421 Rev. 4 - 2
1 of 4
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