DCX124EU_2 Datasheet, PDF (1/12 Pages) Diodes Incorporated – SMALL SIGNAL COMPLEMENTARY PRE-BIASED DUAL TRANSISTOR

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SMALL SIGNAL COMPLEMENTARY PRE-BIASED DUAL TRANSISTOR
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Features
• Epitaxial Planar Die Construction
• Built-In Biasing Resistors
• Surface Mount Package Suited for Automated Assembly
• Lead Free/RoHS Compliant (Note 3)
• "Green" Device (Note 4 and 5)
Mechanical Data
• Case: SOT-363
• Case Material: Molded Plastic. “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
• Terminal Connections: See Diagram
• Marking Information: See Page 11
• Ordering Information: See Page 11
• Weight: 0.006 grams (approximate)
P/N
DCX124EU
DCX144EU
DCX114YU
DCX123JU
DCX114EU
DCX143TU
DCX143EU
DCX114TU
R1
22KΩ
47KΩ
10KΩ
2.2KΩ
10KΩ
4.7KΩ
4.7KΩ
10KΩ
R2
22KΩ
47KΩ
47KΩ
47KΩ
10KΩ
-
4.7KΩ
-
MARKING
C17
C20
C14
C06
C13
C07
C08
C12
A
CXX YM ^{B C}
H
K
M
J
DF
L
CQ1 BQ2 EQ2
6
5
4
Q1
R₁ R₂
R_{2 R1}
Q2
1
2
3
EQ1 BQ1 CQ2
R1, R2
CQ1
6
Q1
BQ2
5
R₁
EQ2
4
R₁
Q2
1
2
3
EQ1 BQ1 CQ2
R1 Only
SCHEMATIC DIAGRAM
SOT-363
Dim Min Max
A 0.10 0.30
B 1.15 1.35
C 2.00 2.20
D 0.65 Nominal
F 0.30 0.40
H 1.80 2.20
J
⎯ 0.10
K 0.90 1.00
L 0.25 0.40
M 0.10 0.25
α
0°
8°
All Dimensions in mm
Q1: NPN Transistor
Q2: PNP Transistor
Maximum Ratings NPN Section @T_A = 25°C unless otherwise specified
Characteristic
Supply Voltage, (6) to (1)
Input Voltage, (2) to (1)
Output Current
Output Current
Power Dissipation (Total)
Thermal Resistance, Junction to Ambient Air
Operating and Storage Temperature Range
DCX124EU
DCX144EU
DCX114YU
DCX123JU
DCX114EU
DCX143TU
DCX143EU
DCX114TU
DCX124EU
DCX144EU
DCX114YU
DCX123JU
DCX114EU
DCX143TU
DCX143EU
DCX114TU
All
(Note 2)
(Note 1)
Symbol
V_CC
V_IN
I_O
I_C (Max)
P_D
R_θJA
T_J, T_STG
Value
50
-10 to +40
-10 to +40
-6 to +40
-5 to +12
-10 to +40
-5V max
-10 to +30
-5V max
30
30
70
100
50
100
100
100
100
200
625
-55 to +150
Unit
V
V
mA
mA
mW
°C/W
°C
Notes:
1. Mounted on FR4 PC Board with recommended pad layout at http://www.diodes.com/datasheets/ap02001.pdf.
2. 150mW per element must not be exceeded.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb₂O₃ Fire Retardants.
DS30347 Rev. 11 - 2
1 of 12
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