BZX84C2V4W_1 Datasheet, PDF (1/3 Pages) Diodes Incorporated – 200mW SURFACE MOUNT ZENER DIODE

BZX84C2V4W - BZX84C39W
200mW SURFACE MOUNT ZENER DIODE
SPICE MODELS: BZX84C2V4W BZX84C2V7W BZX84C3V0W BZX84C3V3W BZX84C3V6W BZX84C3V9W BZX84C4V3W BZX84C4V7W BZX84C5V1W
BZX84C5V6W BZX84C6V2W BZX84C6V8W BZX84C7V5W BZX84C8V2W BZX84C9V1W BZX84C10W BZX84C11W BZX84C12W BZX84C13W BZX84C15W
BZX84C16W BZX84C18W BZX84C20W BZX84C22W BZX84C24W BZX84C27W BZX84C30W BZX84C33W BZX84C36W BZX84C39W
Features
• Planar Die Construction
• 200mW Power Dissipation
• Zener Voltages from 2.4V – 39V
• Ultra-Small Surface Mount Package
• Lead Free/RoHS Compliant (Note 7)
• "Green" Device (Notes 1 and 2)
Mechanical Data
• Case: SOT-323
• Case Material: Molded Plastic, "Green" Molding Compound,
Note 2. UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
K
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over
J
Alloy 42 leadframe).
• Polarity: See Diagram
• Marking: Date Code and Type Code, See Page 2
• Weight: 0.006 grams (approximate)
A
BC
G
H
DF
L
SOT-323
Dim Min Max
A
0.25 0.40
B
1.15 1.35
C
2.00 2.20
D
0.65 Nominal
E
0.30 0.40
G
1.20 1.40
H
1.80 2.20
M
J
0.0 0.10
K
0.90 1.00
L
0.25 0.40
M
0.10 0.18
α
0°
8°
All Dimensions in mm
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Forward Voltage
@ I_{F =} 10mA
V_F
0.9
V
Power Dissipation (Note 3)
P_d
200
mW
Thermal Resistance, Junction to Ambient Air (Note 3)
R_θJA
625
K/W
Operating and Storage Temperature Range
T_j, T_STG
-65 to +125
°C
Ordering Information (Notes 2 and 6)
Device
(Type Number)-7-F
Packaging
SOT-323
Shipping
3000/Tape & Reel
* Add “-7-F” to the appropriate type number in Table 1 from Page 2 example: 6.2V Zener = BZX84C6V2W-7-F.
Notes:
1. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com./products/lead_free/index.php.
2. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
3. Mounted on FR4 PC board with recommended pad layout which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
4. Short duration pulse test used to minimize self-heating effect.
5. f = 1KHz.
6. For Packaging Details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
7. No purposefully added lead.
DS30066 Rev. 13 - 2
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