BZX84C2V4S_15 Datasheet, PDF (1/4 Pages) Diodes Incorporated – DUAL 200mW SURFACE MOUNT ZENER DIODE

Features
• Planar Die Construction
• 200mW Power Dissipation
• Zener Voltages from 2.4V - 39V
• Ultra-Small Surface Mount Package
• Lead Free/RoHS Compliant (Note 2)
• "Green" Device (Note 3 and 4)
BZX84C2V4S - BZX84C39S
DUAL 200mW SURFACE MOUNT ZENER DIODE
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Mechanical Data
• Case: SOT-363
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
• Polarity: See Diagram
• Marking Information: See Page 3
• Ordering Information: See Page 3
• Weight: 0.006 grams (approximate)
C₁
A₁ NC
Top View
NC
A₂
C₂
Device Schematic
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Forward Voltage
@ I_F = 10mA
V_F
0.9
V
Thermal Characteristics
Power Dissipation
Characteristic
Thermal Resistance, Junction to Ambient Air
Operating and Storage Temperature Range
(Note 1)
(Note 1)
Symbol
P_D
R_θJA
T_J, T_STG
Value
200
625
-65 to +150
Unit
mW
°C/W
°C
Notes:
1. Mounted on FR4 PC Board with recommended pad layout which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
BZX84C2V4S - BZX84C39S
Document number: DS30108 Rev. 17 - 2
1 of 4
www.diodes.com
May 2008
© Diodes Incorporated