English
Language : 

BZX84C20-7 Datasheet, PDF (1/4 Pages) Diodes Incorporated – 350mW SURFACE MOUNT ZENER DIODE
Features
• Planar Die Construction
• 350mW Power Dissipation
• Zener Voltages from 2.4V - 39V
• Ideally Suited for Automated Assembly Processes
• Lead, Halogen and Antimony Free, RoHS Compliant "Green"
Device (Notes 3 and 4)
• Qualified to AEC-Q101 Standards for High Reliability
BZX84C2V4 - BZX84C39
350mW SURFACE MOUNT ZENER DIODE
DATASHEET SEARCH SITE | WWW.ALLDATAS
Mechanical Data
• Case: SOT-23
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
• Polarity: See Diagram
• Marking Information: See Page 3
• Ordering Information: See Page 3
• Weight: 0.008 grams (approximate)
Top View
Device Schematic
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Forward Voltage
@ IF = 10mA
VF
0.9
V
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Power Dissipation (Note 2)
Thermal Resistance, Junction to Ambient Air
Thermal Resistance, Junction to Ambient Air
Operating and Storage Temperature Range
(Note 1)
(Note 2)
Symbol
PD
PD
RθJA
RθJA
TJ, TSTG
Value
300
350
417
357
-65 to +150
Unit
mW
mW
°C/W
°C/W
°C
Notes:
1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
2. Valid provided the terminals are kept at ambient temperature.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Data Code OW (week 42, 2009) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code OW are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
BZX84C2V4 - BZX84C39
Document number: DS18001 Rev. 28 - 2
1 of 4
www.diodes.com
April 2010
© Diodes Incorporated