BZT52C2V4LP Datasheet, PDF (1/4 Pages) Diodes Incorporated – SURFACE MOUNT ZENER DIODE

Features
• Ultra-Small Leadless Surface Mount Package
• Ideally Suited for Automated Assembly Processes
• Lead Free By Design/RoHS Compliant (Note 1)
• "Green" Device (Note 2)
• Qualified to AEC-Q101 Standards for High Reliability
BZT52C2V4LP - BZT52C39LP
SURFACE MOUNT ZENER DIODE
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Mechanical Data
• Case: DFN1006-2
• Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminal Connections: Cathode Dot (See Marking Information)
• Terminals: Finish ⎯ NiPdAu Over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
• Marking Information: See Page 3
• Ordering Information: See Page 3
• Weight: 0.001 grams
Bottom View
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Forward Voltage (Note 4)
@ I_F = 10mA
Symbol
V_F
Value
0.9
Thermal Characteristics
Characteristic
Power Dissipation
Thermal Resistance, Junction to Ambient Air
Operating and Storage Temperature Range
(Note 3) T_A = 25°C
(Note 3) T_A = 25°C
Symbol
P_D
R_θJA
T_J, T_STG
Value
250
500
-65 to +150
Notes:
1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Device mounted on FR-4 PCB with minimum recommended pad layout pattern as shown on page 4.
4. Short duration pulse test used to minimize self-heating effect.
Unit
V
Unit
mW
°C/W
°C
BZT52C2V4LP - BZT52C39LP
Document number: DS30506 Rev. 17 - 2
1 of 4
www.diodes.com
August 2008
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