BZT52C2V0_08 Datasheet, PDF (1/4 Pages) Diodes Incorporated – SURFACE MOUNT ZENER DIODE

Features
• Planar Die Construction
• 500mW Power Dissipation on Ceramic PCB
• General Purpose, Medium Current
• Ideally Suited for Automated Assembly Processes
• Lead, Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 2 and 3)
• Qualified to AEC-Q101 Standards for High Reliability
BZT52C2V0 - BZT52C39
SURFACE MOUNT ZENER DIODE
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Mechanical Data
• Case: SOD-123
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe)
• Polarity: Cathode Band
• Marking Information: See Page 3
• Ordering Information: See Page 3
• Weight: 0.010 grams (approximate)
Top View
Maximum Ratings @T_A = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Symbol
Value
Unit
Forward Voltage @ I_F = 10mA
V_F
0.9
V
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 1)
P_D
500
mW
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
R_θJA
T_J, T_STG
250
-65 to +150
°C/W
°C
Notes:
1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm².
2. No purposefully added lead. Halogen and Antimony Free.
3. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb₂O₃ Fire Retardants.
BZT52C2V0 - BZT52C39
Document number: DS18004 Rev. 32 - 2
1 of 4
www.diodes.com
June 2008
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