BZT52C2V0 Datasheet, PDF (1/3 Pages) Diodes Incorporated – SURFACE MOUNT ZENER DIODE

BZT52C2V0 - BZT52C39
SURFACE MOUNT ZENER DIODE
SPICE MODELS: BZT52C2V0 BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C3V3 BZT52C3V6 BZT52C3V9 BZT52C4V3 BZT52C4V7 BZT52C5V1
BZT52C5V6 BZT52C6V2 BZT52C6V8 BZT52C7V5 BZT52C8V2 BZT52C9V1 BZT52C10 BZT52C11 BZT52C12 BZT52C13 BZT52C15 BZT52C16
BZT52C18 BZT52C20 BZT52C22 BZT52C24 BZT52C27 BZT52C30 BZT52C33 BZT52C36 BZT52C39
Features
· Planar Die Construction
· 500mW Power Dissipation on Ceramic PCB
· General Purpose, Medium Current
· Ideally Suited for Automated Assembly
Processes
· Available in Lead Free Version
H
SOD-123
Dim Min Max
A
3.55 3.85
D
J
B
2.55 2.85
Mechanical Data
G
· Case: SOD-123, Plastic
A
· UL Flammability Classification Rating 94V-0
B
· Moisture Sensitivity: Level 1 per J-STD-020A
C
E
· Terminals: Solderable per MIL-STD-202,
Method 208
· Also Available in Lead Free Plating
(Matte Tin Finish). Please See
Ordering Information, Note 5, on Page 2
· Polarity: Cathode Band
· Marking: See Below
· Weight: 0.01 grams (approx.)
· Ordering Information: See Page 2
C
1.40 1.70
D
— 1.35
E
0.55 Typical
G
0.25
—
H
0.11 Typical
J
— 0.10
a
0°
8°
All Dimensions in mm
Maximum Ratings ^{@ T}A ^{= 25°C unless otherwise specified}
Characteristic
Forward Voltage (Note 2)
@ IF = 10mA
Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Symbol
VF
Pd
R_qJA
T_j, T_STG
Value
0.9
500
305
-65 to +150
Notes: 1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm².
2. Short duration test pulse used to minimize self-heating effect.
Unit
V
mW
°C/W
°C
Marking Information
Date Code Key
Year
Code
Month
Code
XX
XX = Product Type Marking Code (See Page 2)
YM = Date Code Marking
Y = Year (ex: N = 2002)
M = Month (ex: 9 = September)
1998
J
Jan
1
1999
K
Feb
2
2000
L
March
3
2001
M
Apr
4
2002
N
May
5
2003
P
Jun
6
2004
R
Jul
7
2005
S
Aug
8
2006
T
Sep
9
2007
U
Oct
O
2008
V
Nov
N
2009
W
Dec
D
DS18004 Rev. 21 - 2
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BZT52C2V0 - BZT52C39