BC847PN_08 Datasheet, PDF (1/4 Pages) Diodes Incorporated – COMPLEMENTARY PAIR SMALL SIGNAL SURFACE MOUNT TRANSISTOR

BC847PN
COMPLEMENTARY PAIR SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
• Epitaxial Die Construction
• Two Internally Isolated NPN/PNP Transistors in one package
• Ultra-Small Surface Mount Package
• Lead Free/RoHS Compliant (Note 2)
• Qualified to AEC-Q101 Standards for High Reliability
• "Green" Device (Notes 3 and 4)
Mechanical Data
• Case: SOT-363
• Case Material: Molded Plastic, “Green” Molding Compound,
Note 4. UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating) Solderable per MIL-STD-202, Method 208
• Terminal Connections: See Diagram
• Marking Information: See Page 4
• Ordering Information: See Page 4
• Weight: 0.006 grams (approximate)
C₁
B₂
E₂
Top View
E₁
B₁
C₂
Device Schematic
Maximum Ratings, NPN Section @T_A = 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Peak Collector Current
Peak Emitter Current
Symbol
V_CBO
V_CEO
V_EBO
I_C
I_CM
I_EM
Value
50
45
6.0
100
200
200
Unit
V
V
V
mA
mA
mA
Maximum Ratings, PNP Section @T_A = 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Peak Collector Current
Peak Emitter Current
Symbol
V_CBO
V_CEO
V_EBO
I_C
I_CM
I_EM
Value
-50
-45
-5.0
-100
-200
-200
Unit
V
V
V
mA
mA
mA
Thermal Characteristics
Characteristic
Power Dissipation (Note 1) @ T_A = 25°C Total Device
Thermal Resistance, Junction to Ambient (Note 1) @ T_A = 25°C
Operating and Storage Temperature Range
Symbol
P_D
R_θJA
T_J, T_STG
Value
200
625
-65 to +150
Unit
mW
°C/W
°C
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants
BC847PN
Document number: DS30278 Rev. 12 - 2
1 of 4
www.diodes.com
November 2008
© Diodes Incorporated