BC847CDLP Datasheet, PDF (1/4 Pages) Diodes Incorporated – NPN DUAL SURFACE MOUNT TRANSISTOR

BC847CDLP
NPN DUAL SURFACE MOUNT TRANSISTOR
Features
• Epitaxial Planar Die Construction
• Ideally Suited for Automated Assembly Processes
• Lead Free By Design/RoHS Compliant (Note 1)
BE
C
• "Green" Device (Note 2)
• Ultra Low Profile Package
Mechanical Data
C
EB
Top View
• Case: DFN1310H4-6
GH
• Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating
94V-0
Side View
• Moisture Sensitivity: Level 1 per J-STD-020C
• Terminals: Finish ⎯ NiPdAu annealed over Copper
Z
K
L
leadframe (Lead Free Plating). Solderable per MIL-
STD-202, Method 208
• Marking Code Information: See Page 4
• Ordering Information: See Page 4
C
B
E
B ^NRo0te.1450
E
• Weight: 0.0015g (approximate)
L
N
C
D
EBC
D
Internal Schematic
NM
Z
(TOP VIEW)
A
Bottom View
DFN1310H4-6
Dim Min Max Typ
A 1.25 1.38 1.30
B 0.95 1.08 1.00
C 0.20 0.30 0.25
D* -
- 0.10
E** -
- 0.20
G
- 0.40 -
H
0 0.05 0.02
K* 0.10 0.20 0.15
L* 0.30 0.50 0.40
M** -
- 0.35
N* -
- 0.25
Z** -
- 0.05
All Dimensions in mm
* Dimensions D, K, L, N Repeat 4X
** Dimensions E, M, Z Repeat 2X
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Power Dissipation (Note 3)
Symbol
V_CBO
V_CEO
V_EBO
I_C
P_d
Value
50
45
6.0
100
350
Unit
V
V
V
mA
mW
Thermal Resistance, Junction to Ambient (Note 3)
Operating and Storage Temperature Range
R_θJA
T_j, T_STG
357
-65 to +150
°C/W
°C
Notes:
1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Device mounted on FR-4 PCB pad layout as shown on page 4.
4. Radiused pad feature is intended for device manufacturing control and should not be considered as a polarity indicator, or to suggest orientation of
the devices in the carrier tape.
DS30817 Rev. 6 - 2
1 of 4
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BC847CDLP
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