BAV99DW_09 Datasheet, PDF (1/3 Pages) Diodes Incorporated – SURFACE MOUNT SWITCHING DIODE ARRAY

Features
• Fast Switching Speed
• Ultra-Small Surface Mount Package
• For General Purpose Switching Applications
• High Conductance
• Two “BAV99” Circuits In One Package
• Lead Free/RoHS Compliant (Note 3)
• Qualified to AEC-Q101 Standards for High Reliability
• "Green" Device (Notes 4 and 5)
BAV99DW
SURFACE MOUNT SWITCHING DIODE ARRAY
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Mechanical Data
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SOT-363
Case: SOT-363
Case Material: Molded Plastic, “Green” Molding Compound
(Note 5). UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Polarity: See Diagram
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.006 grams (approximate)
AC
1
C₂
A₂
TOP VIEW
A₁
C₁
AC
2
TOP VIEW
Internal Schematic
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Non-Repetitive Peak Reverse Voltage
V_RM
100
V
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V_RRM
V_RWM
75
V
V_R
RMS Reverse Voltage
V_R(RMS)
53
V
Forward Continuous Current
(Note 1)
I_FM
215
mA
Non-Repetitive Peak Forward Surge Current
@ t = 1.0μs
2.0
@ t = 1.0ms
I_FSM
1.0
A
@ t = 1.0s
0.5
Thermal Characteristics
Characteristic
Power Dissipation
Power Dissipation
Thermal Resistance Junction to Ambient Air
Thermal Resistance Junction to Ambient Air
Operating and Storage Temperature Range
(Note 1)
(Note 2)
(Note 1)
(Note 2)
Symbol
P_D
P_D
R_θJA
R_θJA
T_J , T_STG
Value
200
300
625
417
-65 to +150
Unit
mW
mW
°C/W
°C/W
°C
Electrical Characteristics @T_A = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 6)
Forward Voltage
Reverse Current (Note 6)
Total Capacitance
Reverse Recovery Time
Symbol Min
V_(BR)R
75
V_F
⎯
I_R
⎯
C_T
⎯
t_rr
⎯
Max
⎯
0.715
0.855
1.0
1.25
2.5
50
30
25
2.0
4.0
Unit
V
V
μA
μA
μA
nA
pF
ns
Test Condition
I_R = 2.5μA
I_F = 1.0mA
I_F = 10mA
I_F = 50mA
I_F = 150mA
V_R = 75V
V_R = 75V, T_J = 150°C
V_R = 25V, T_J = 150°C
V_R = 20V
V_R = 0, f = 1.0MHz
I_F = I_R = 10mA,
I_rr = 0.1 x I_R, R_L = 100Ω
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Device mounted on Alumina PCB, 0.4 inch x 0.3 inch x 0.024 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
6. Short duration pulse test used to minimize self-heating effect.
BAV99DW
Document number: DS30145 Rev. 13 - 2
1 of 3
www.diodes.com
January 2009
© Diodes Incorporated